Kulicke & Soffa
984 6 Dicing alternatives
Comparable Dicing & Grinding equipment documented in the Waferpedia catalog.
6 comparable tools
Disco
DAG 810 Automatic
Dicing & Grinding
The Disco DAG 810 is an automatic grinder for semiconductor wafer processing, offering a spindle rated at 4.2 kW, torque 5.9 N·m, and speed range 1,000 to 7,000 min⁻¹.
Lapmaster
15
Dicing & Grinding
The Lapmaster Model 15 is a bench-mounted unit with a rigid, lightweight, cast aluminum base, of the 'ring lapper' configuration, enabling high standards of flatness and surface finish.
Blanchard
18 D Surface
Dicing & Grinding
The Blanchard 18 D Surface is a vertical-spindle rotary-table surface grinding machine used to produce flat, parallel surfaces on metal workpieces.
Blanchard
20 36 Surface
Dicing & Grinding
The Blanchard 20 36 Surface is a surface grinder used in dicing and grinding applications.
Blanchard
22 AD 42
Dicing & Grinding
Disco
321
Dicing & Grinding
Disco 321 is a wafer dicing saw designed for dicing semiconductor wafers.
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