Comparison ledger
Hitachi 1305 BSG 3, Tokyo Electron Clean Track ACT 8 Multi Block, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 1305 BSG 3Hitachi | Clean Track ACT 8 Multi BlockTokyo Electron |
|---|---|---|
| OEM | Hitachi | Tokyo Electron |
| Category | Wet Processing / Clean | Wet Processing / Clean |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | 1997 Date of manufacture · 2017 Date of manufacture |
| Control system | — | — |
| Generation | — | — |
| Family | Hitachi 1305 BSG 3 | Tokyo Electron Clean Track ACT 8 Multi Block |
| Cited variants | — |
|
| Specifications | ||
| Date of Manufacture | — | 1997-12-31[2] |
| Currently Configured for | — | 200mm[2] |
| OEM | — | Tokyo Electron[1] |
| Model | — | Clean Track ACT 8 Multi Block[2] |
| Type | — | Multi Block (Resist Coater/Developer)[1] |
| Equipment class | — | Resist Processing Equipment[2] |
| Wafer configuration | — | 200mm[2] |
| Date of manufacture | — | 2017-01-01[1] |
| Purpose | — | Photoresist spin-coater and developer[3] |
| Wafer Size | — | 200mm[4] |
| Resist Types | — | Negative tone and positive tone[3] |
| Supported Resists | — | KMPR-1005 (1002), OIR-647-17(11)[3] |
| Pre-wet Solvents | — | Cyclopentanone or HMDS[3] |
| Bake Capabilities | — | Soft-bake and post-exposure bake[3] |
| Interface | — | Direct interface with ASML stepper[3] |
| Equipment Type | — | Resist Processing Equipment / Multi Block (Resist Coater/Developer)[2] |
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