Comparison ledger
Esec Datacon 2200 evo advanced, Esec Datacon 2200 evo plus, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | ||
|---|---|---|
| OEM | Esec | Esec |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | 4" | 4" |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | 3rd generation | — |
| Family | Esec Datacon 2200 evo advanced | Esec Datacon 2200 evo plus |
| Cited variants | ||
| Specifications | ||
| Bonding method | Epoxy[1] | Epoxy[1] |
| Cycle time | 120 ms with Liquid Cooling option[1] | 120 ms with Liquid Cooling option[1] |
| Bonding accuracy | 20 µm @ 3σ (15 µm option)[1] | 20 µm @ 3σ (15 µm option)[1] |
| Wafer size | 4" to 12" (on 8" or 12" wafer frames)[1] | 4" to 12" (on 8" or 12" wafer frames)[1] |
| Die size | 0.25 mm (with Small Die Kit) to 20 mm[1] | 0.25 mm (with Small Die Kit) to 20 mm[1] |
| Leadframe size | Length: 90 to 300 mm; Width: 23 to 100 mm[1] | Length: 90 to 300 mm; Width: 23 to 100 mm[1] |
| Machine dimensions | 1785 x 1448 x 1400 mm (W x D x H)[1] | 1785 x 1448 x 1400 mm (W x D x H)[1] |
| Bond force | — | 0.5N to 75N programmable[3] |
| Bond heads | — | Up to 4 working heads in one machine[3] |
| Theta placement accuracy | — | ± 0.15° @ 3σ[3] |
| X/Y placement accuracy | — | ± 10 µm @ 3σ[3] |
| Die attach throughput | — | Up to 7,000 UPH/module[3] |
| Flip chip throughput with dipping | — | Up to 2,500 UPH/module[3] |
| Flip chip throughput without dipping | — | Up to 3,200 UPH/module[3] |
| Die attach size | — | 0.17 mm - 50 mm[3] |
| Die size flip chip | — | 0.5 mm - 50 mm[3] |
| Die thickness | — | >50 µm[3] |
| Weight | — | 1,300 kg[3] |
| Frame size | — | FF070, FF105, FF108, FF123[3] |
| Heated bond head | — | Up to 450°C (optional)[3] |
| Product type | — | Die bonder for Multi Module Attach[4] |
| Standard bond head rotation | — | 0° - 360°[4] |
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