Comparison ledger
Disco DFL 7161 FX, Disco DFL 7361, Disco DFL 7560 L, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | DFL 7161 FXDisco | DFL 7361Disco | DFL 7560 LDisco |
|---|---|---|---|
| OEM | Disco | Disco | Disco |
| Category | Dicing & Grinding | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | Integrated Wafer Cleaning System with Atomizing Nozzle | Robot Wafer handling |
| Process node | — | — | — |
| Introduced | — | — | — |
| Production run | — | — | — |
| Lifecycle | — | — | — |
| Lifecycle milestones | — | — | — |
| Control system | — | — | — |
| Generation | — | — | — |
| Family | Disco DFL | Disco DFL | Disco DFL |
| Cited variants | — |
|
|
| Specifications | |||
| Laser head usage | 40 H[4] | — | — |
| OEM | Disco[4] | Disco[1] | — |
| Model | DFL 7161 FX[4] | DFL 7361[1] | — |
| Equipment type | Laser Saw[4] | — | — |
| Vintage | 2019[4] | — | — |
| Configuration | — | Type FX Laser Head[1] | Operation by touch panel LCD monitor[3] |
| Wafer size | — | Integrated Wafer Cleaning System with Atomizing Nozzle[1] | Robot Wafer handling[3] |
| Max workpiece size | — | ø300 mm[2] | — |
| Processing mode | — | Fully automatic[2] | — |
| X-axis feed speed range | — | 0.1 - 1,000 mm/s[2] | — |
| Y-axis positioning accuracy | — | 0.003 mm within 310 mm[2] | — |
| Dimensions (W x D x H) | — | 1,210 x 3,270 x 1,906 mm[2] | 2,000 x 1,810 x 1,800 mm[5] |
| Weight | — | approx 2,570 kg[2] | approx. 3,300 kg[5] |
| Supported wafer size | — | 2" to 12"[1] | — |
| Laser head | — | Type FX[1] | — |
| Optics system | — | BSS-6[1] | — |
| Wafer cleaning system | — | Integrated with Atomizing Nozzle[1] | — |
| Category | — | Laser Saw[1] | — |
| Maximum workpiece size | — | ø300 mm[2] | — |
| Processing method | — | Fully automatic[2] | — |
| Dimensions (WxDxH) | — | 1,210 x 3,270 x 1,906 mm[2] | — |
| Chuck table | — | Chuck Table moving in X- and Y-direction; 12" and 8" Porous Chuck Table & Spinner Table[1] | — |
| User interface | — | Graphical User Interface with Touch Screen[1] | — |
| Vision system | — | High Resolution Image Processing System with Auto Focus[1] | — |
| Frame handling | — | Fully Automatic Frame Handling System[1] | — |
| Coating system | — | Independent Hogomax spin coating system[1] | — |
| Loading/unloading | — | Cassette Loading / Unloading[1] | — |
| Duct unit | — | Duct Unit (Internal Type)[1] | — |
| Power conditioning | — | Overseas Transformer Unit; Uninterruptible Power Supply[1] | — |
| Documentation | — | Operation & Troubleshooting Manual (English); Installation and 3-days Operation Training[1] | — |
| Ablation processing support | — | Supports ablation processing; corresponding to 300mm workpiece[2] | — |
| Laser Head Type | — | Type FX[1] | — |
| Chuck Table Movement | — | X and Y direction[1] | — |
| Image Processing | — | High Resolution Image Processing System with Auto Focus[1] | — |
| Spin Coating System | — | Independent Hogomax spin coating system[1] | — |
| Chuck Table Sizes | — | 12" and 8" Porous Chuck Table & Spinner Table[1] | — |
| Cassette Handling | — | Cassette Loading / Unloading[1] | — |
| Duct Unit | — | Internal Type[1] | — |
| Transformer | — | Overseas Transformer Unit[1] | — |
| Power Supply | — | Uninterruptible Power Supply[1] | Step-down Transformer 400 V, 3 phases, 50 Hz[3] |
| X-Axis Feed Speed | — | 0.1 - 1,000 mm/s[2] | — |
| Y-Axis Positioning Accuracy | — | 0.003 mm or less per 310 mm[2] | — |
| Wafer | — | — | Can be modified at later date to 3”, 4” & 6” wafers and frame[3] |
| Uninterruptible Power Supply | — | — | 1[3] |
| Wafer Sizes (standard) | — | — | 2, 3, 4 inch[3] |
| Wafer Size Modification | — | — | Can be modified to 3”, 4” & 6” wafers and frame[3] |
| Maximum Workpiece Size | — | — | ø150 mm[5] |
| Processing Mode | — | — | Fully automatic[5] |
| Robot Wafer Handling | — | — | Yes[3] |
| Operation Interface | — | — | Touch panel LCD monitor[3] |
| CE Marking | — | — | Yes[3] |
| Microscope | — | — | Low and High Magnification microscope with LED illumination[3] |
| Axis Control | — | — | X and Y axis with linear scale closed loop control[3] |
| Laser Cooling | — | — | Laser power supply with built in water cooled chillers[3] |
| Additional Chiller | — | — | Chiller unit to supply cooling water for Laser power supply[3] |
| X Axis Chiller | — | — | Chiller unit to supply cooling water to X axis[3] |
| Z Axis Positional Repeatability | — | — | 0.002 mm[3] |
| Optional Upgrade | — | — | 200 mm Fully Automatic wafer handling from/to standard wafer cassette, Chuck for 200mm wafers, New robot design for handling heavier wafers, 6 inch Lens and new Galvo Scanner[3] |
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