Comparison ledger
DEK 2Di, Koh Young 2014-09-11T12, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 2DiDEK | 2014-09-11T12Koh Young |
|---|---|---|
| OEM | DEK | Koh Young |
| Category | Assembly / SMT | Assembly / SMT |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | DEK 2Di | Koh Young 2014-09-11T12 |
| Specifications | ||
| inspection type | built-in 2-dimensional inspection system[1] | — |
| stencil inspection | detects blocked apertures and underside smearing[1] | — |
| board inspection | verifies correct paste location, alignment, and bridge detection[1] | — |
| camera system | coaxial look-up/look-down camera system[1] | — |
| lighting | advanced lighting with flat lighting, direct and indirect light, and an illuminated annular ring[1] | — |
| optics | telecentric lenses[1] | — |
| repeatability | 3-sigma repeatability[1] | — |
| board inspection repeatability | better than 5% 3-sigma repeatability in tests carried out by DEK[1] | — |
| processing time | 0.2 s per site[1] | — |
| inspection mode | OnePre mode captures a single pre-image of the first board for subsequent paste measurement cycles[1] | — |
| automation | selectable-mode automatic stencil cleaning cycle and alert mode[1] | — |
| Semiconductor Solutions | — | Listed as one of the company’s business areas[2] |
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