Waferpedia

Comparison ledger

IsoMet 1000 Precisionversus3220

Buehler IsoMet 1000 Precision, Disco 3220, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
3220Disco
OEMBuehlerDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBuehler IsoMet 1000 PrecisionDisco 3220
Specifications
Blade Diameter Range4-7 inches [102-178mm][1]—
Arbor Size0.5 inch [12.7mm][1]—
Wheel Speed100-975 rpm[1]—
Motor Power1/8 HP (90W)[2]—
Voltage/Frequency85-264V, 50/60Hz[1]—
Weight56 lbs [25kg][1]—
Shipping Weight75 lbs [34kg][2]—
Dimensions (W x D x H)15.5 W x 21 D x 12 in H [394 x 533 x 305mm][1]—
Sound Rating70dB – no load[1]—
Control TypeMembrane touch-pad panel[1]—
equipment type—dicing saw[3]
Workplace size—ø150 mm[4]
Spindle layout—Single[4]
Spindle output—1.5 kW at 30,000 min-1[4]
Spindle max revolution speed—40,000 min-1[4]
X-axis feed speed range—0.1 – 500 mm/s[4]
Y-axis index step—0.0001 mm[4]
Z-axis repeating accuracy—0.001 mm[4]
Z-axis max blade size—ø58 mm[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]documents.thermofisher.comdocuments.thermofisher.com
  2. [2]fab.cba.mit.edufab.cba.mit.edu
  3. [3]nanofab.utah.edunanofab.utah.edu
  4. [4]semistarcorp.comsemistarcorp.com