Comparison ledger
AJA TR5313, Applied Materials 0010-13622 RF Match for, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | TR5313AJA | 0010-13622 RF Match forApplied Materials |
|---|---|---|
| OEM | AJA | Applied Materials |
| Category | Deposition | Deposition |
| Wafer size | up to 8-inch diameter substrates | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | AJA TR5313 | Applied Materials 0010-13622 RF Match for |
| Specifications | ||
| model | TR5313[1] | — |
| type | triangular magnetron[1] | — |
| description | specialty source designed to optimize deposition uniformity onto a circle of substrates up to 8" Ø[1] | — |
| use in system | used in the ATC-B-3400 mask making tool[1] | — |
| materials per batch in cited system | up to 3 materials[1] | — |
| substrates per batch in cited system | (6) 8" wafers per batch[1] | — |
| Type | Triangular magnetron sputter source[1] | — |
| Maximum substrate diameter | 8 inches[1] | — |
| Purpose | Optimize deposition uniformity onto a circle of substrates[1] | — |
| Usage in system | ATC-B-3400 mask making tool: processes 6 x 8" wafers per batch with up to 3 materials deposited from TR5313 magnetrons[2] | — |
| Configuration | — | High Efficiency HE RF Match-Bias[3] |
| Model | — | 0010-13622[3] |
| Product Type | — | RF Match for PVD (Physical Vapor Deposition)[3] |
| Feature | — | High Efficiency HE RF Match-Bias[3] |
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