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YES

PB6

DiscontinuedTabletop vacuum curing systemYES PB6 family
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Vacuum

Tabletop vacuum cure system[1]

Performance

± 5°C[1]

What is it?

The source identifies the PB Series as tabletop vacuum curing systems and states that the PB6 was a YES-PB6 vacuum cure system. It also states that support for the YES-PB6 vacuum cure system was discontinued effective January 1, 2021.

What can it run?

Process applications and technology nodes documented for this tool.

  • Polyimide/PBO cure
  • BCB bake
  • Low temp polymer cure
  • Copper anneal
  • Low-K dielectric cure
  • polyimide
  • epoxy
  • wafer-to-wafer bonding anneal
  • advanced packaging
  • CMOS image sensor
  • fan-out wafer level packaging (FOWLP)
  • semiconductor front-end anneal and degas
  • RF devices

What do the numbers mean?

Vacuum & pumping1

System type
Tabletop vacuum cure system[1]
Accurate?

Wafer handling1

System family variants stated
PB8 for up to 2 cassettes of 200mm wafers; PB12 for up to 2 cassettes of 300mm wafers[1]
Accurate?

Performance1

Temperature uniformity during dwell
± 5°C[1]
Accurate?

Control & software1

Process management software compatibility
SEMI E5-0308 and SEMI E30-0307 compatible module[1]
Accurate?

Configuration & options2

Operating temperature
ambient to 450°C[1]
Accurate?
Optional high temperature version
ambient to 550°C[1]
Accurate?

Vintage & configurations

  1. 2021-01-01OEM support ended[1]

    Support for the YES-PB6 vacuum cure system was discontinued effective January 1, 2021.

Documented models & variants

DesignationGenerationVintageChangesSource
PB8——For up to 2 cassettes of 200mm wafers.web.archive.org[1]
PB12——For up to 2 cassettes of 300mm wafers.web.archive.org[1]
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • System typeTabletop vacuum cure system[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Not publicly documented

The following facts about the PB6 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • The control-system platform and OS era of the PB6 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the PB6 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the PB6 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the PB6 are on record.

    Answerable by: an OEM parts catalog or a service engineer

  • No publicly hosted manuals, SOPs, or datasheets for the PB6 are on record.

    Answerable by: university cleanroom staff or an OEM application specialist

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Sources & citations

Sources (1)Every fact above is drawn from these public sources
  1. [1]web.archive.org — web.archive.orgweb.archive.org
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Last updated Sep 22, 2026.