West Bond
7KF Series
The West Bond 7KF Series is a manual wire bonder line. The West Bond 7KF Series uses a throat-less chassis and micromanipulator design. The West Bond 7KF Series can be configured for microwave, semiconductor, RF, and hybrid production.[1]
What it is
The West Bond 7KF Series is a manual wire bonder for microelectronics packaging.[1]
How it works
Where it fits in the process flow
The West Bond 7KF Series is intended for microwave, semiconductor, radio frequency, and hybrid production.[1]
Applications
The West Bond 7KF Series can be used for microwave, semiconductor, radio frequency, and hybrid production.[1]
The West Bond 7KF Series supports wire, ribbon, ball bonding, insulated wire, and single point tab or lead bonding.[1]
- Microwave production
- Semiconductor production
- RF production
- Hybrid production
What do the numbers mean?
Power & electrical1
Configuration & options4
- Bonding capabilities
- 45° wedge, 90° feed for wire and ribbon, ball bonding, insulated wire, and single point tab / lead bonding[1]
Vintage & configurations
- 1966Production start[1]
West Bond says it has designed and manufactured wire bonding and die attach machines since 1966.
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- ApplicationsMicrowave, semiconductor, RF, and hybrid production[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What bond modes can the West Bond 7KF Series handle?
The West Bond 7KF Series can handle 45 degree wedge bonding, 90 degree feed bonding for wire and ribbon, ball bonding, insulated wire bonding, and single point tab or lead bonding.[1]
What types of production is the West Bond 7KF Series intended for?
The West Bond 7KF Series is configured for microwave, semiconductor, radio frequency, and hybrid production.[1]
What chassis design does the West Bond 7KF Series use?
The West Bond 7KF Series uses a throat-less chassis.[1]
Not publicly documented
The following facts about the 7KF Series are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented variants, configuration options, or revision breakpoints of the 7KF Series are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 7KF Series are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 7KF Series are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 7KF Series is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the 7KF Series are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (1)Every fact above is drawn from these public sources
- [1]cltrep.com — cltrep.comcltrep.com
Last updated Oct 2, 2026.
Compare with similar tools
View all →
Applied Materials model 0010-47763 is an ASSY ESC Bonded Monopolar Dual Heated unit.
The Applied Materials 0041-26723 is a bonded assembly used in semiconductor packaging and bonding applications.
The Logitech 1 WBS 1 is a wafer substrate bonder for 6-inch wafers.
