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West Bond

7KE

Packaging & BondingWest Bond 7KE family
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The West Bond model 7KE is a convertible manual wire bonder. The 7KE interconnects gold wire leads to various semiconductor devices. The 7KE is located in the FabLab Exploratory Lab at the University of Maryland.[1]

West Bond7KE
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What it is

The West Bond 7KE is a convertible manual wire bonder used to interconnect gold wire leads to various semiconductor devices.[1]

How it works

General reference — not yet source-verified

Wire bonders join fine wire — typically gold or aluminum — between a semiconductor die and its package or substrate using thermocompression, thermosonic, or ultrasonic energy. In manual wire bonders like the 7KE, an operator positions a bonding tool under a microscope and actuates the bond head to create each connection one at a time.

Where it fits in the process flow

General reference — not yet source-verified

Wire bonding is a final-assembly step in semiconductor packaging, performed after wafer dicing and die attach. The wire bonder connects bond pads on the die to lead fingers or substrate lands, completing the electrical path from the chip to the external package terminals.

Applications

The West Bond 7KE is used for interconnecting gold wire leads to semiconductor devices in a laboratory or prototyping environment.[1]

  • Interconnecting gold wire leads to semiconductor devices

What do the numbers mean?

Configuration & options10

Manufacturer
West Bond[1]
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Model
7KE[1]
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Equipment type
Wire bonder[1]
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Description
Convertible manual wire bonder[1]
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Intended use
Interconnect gold wire leads to various semiconductor devices[1]
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Wire material noted
Aluminum wire available[1]
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Operation access
Limited to users approved and trained by FabLab staff[1]
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Type
Convertible manual wire bonder[1]
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Wire material
Gold (aluminum also available)[1]
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Operation
Manual[1]
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Where are the manuals?

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Not publicly documented

Field notes

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Frequently asked questions

Is the West Bond 7KE a manual or automated bonder?

The West Bond 7KE is a convertible manual wire bonder.[1]

Not publicly documented

The following facts about the 7KE are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 7KE are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the 7KE are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the 7KE are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the 7KE are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the 7KE is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (3)Every fact above is drawn from these public sources
  1. [1]nanocenter.umd.edu — nanocenter.umd.edunanocenter.umd.edu
  2. [2]Equipment | FabLab | Maryland NanoCenter — nanocenter.umd.edunanocenter.umd.edu
  3. [3]Equipment | FabLab | Maryland NanoCenter — nanocenter.umd.edunanocenter.umd.edu
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Last updated Oct 4, 2026.

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