Tokyo Electron
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The Unity II E 855 II Dry is a dry etcher from Tokyo Electron. The Unity II E 855 II Dry processes 8-inch wafers.[1][2]
The model designation is Unity II E 855 II.[2]
A dry etcher removes material from a wafer with a plasma-based process rather than with liquid chemistry.
Dry etching generally uses a gas environment and electric fields to generate reactive species that transfer pattern information from a mask into the exposed film or substrate.
A dry etcher sits in the pattern-transfer portion of the wafer fabrication flow after lithography has defined the feature pattern on a masking layer.
The etch step is followed by mask removal, cleaning, inspection, and later process modules that build or finish the device structure.
Dry etchers are used for anisotropic pattern transfer in semiconductor manufacturing.
Dry etching is used to form features in thin films, dielectric layers, and other patterned materials where directional material removal is required.
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The following facts about the Unity II E 855 II Dry are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Unity II E 855 II Dry are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Unity II E 855 II Dry are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Unity II E 855 II Dry are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Unity II E 855 II Dry are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Unity II E 855 II Dry is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 8, 2026.
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