Tokyo Electron
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The Tel Unity II 85 DP is a dry etcher for 8-inch wafers.[1]
The Unity II 85 DP is a dry etch system. The Unity II 85 DP is made by Tel. The Unity II 85 DP is configured for wafers with an 8-inch diameter.[1]
Dry etchers process wafers inside a vacuum chamber. A process gas is introduced into the chamber and excited into a plasma by radio-frequency power. The plasma contains ions and reactive radicals that attack exposed film material on the wafer. Etching can occur through chemical reactions, physical ion bombardment, or a combination of both. Process parameters such as gas composition, pressure, and power determine the etch rate and anisotropy.
Etch is used after photolithography to transfer a pattern into the underlying film. The patterned photoresist covers areas that should remain; the dry etcher removes material in the open areas. Following the etch step, the resist is stripped and the wafer is cleaned before further processing.
Dry etch tools pattern dielectric films, semiconductor materials, and conductive layers. Common applications include gate structuring, contact and via formation, and interconnect patterning. Dry etching provides anisotropic profiles for high-fidelity pattern transfer in integrated-circuit fabrication.
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The following facts about the Unity II 85 DP Dry are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Unity II 85 DP Dry are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Unity II 85 DP Dry are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Unity II 85 DP Dry are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Unity II 85 DP Dry are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Unity II 85 DP Dry is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 1, 2026.
The Applied Materials 0010-47763 is an electrostatic chuck (ESC) assembly used in semiconductor etching processes.
The Applied Materials 0010-16392 is an electrostatic chuck assembly designed for 300 mm wafer processing, featuring a dual electrode configuration.
Oxford Instruments 100 ICP Fluorine is an inductively coupled plasma etcher for fluorine-based etching, supporting cryo DRIE and multiple etch gases including SF6 and C4F8.