Tegal
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Plate 01Tegal 915 plasma asher etcher descum semiconductor equipment
The Tegal 915 is an etcher in the Tegal 9XX series of plasma etch systems.[1]
A plasma is generated by applying radio-frequency power to a low-pressure process gas inside a vacuum chamber. The energized gas molecules dissociate into ions and radicals that interact with the substrate surface. Ions are accelerated toward the substrate by an electric field, providing anisotropic etching, while neutral radicals contribute isotropic chemical etching.
Plasma etching is performed after photolithographic patterning to transfer the mask pattern into an underlying film. The etched features define structures such as transistor gates, dielectric contacts, or metal interconnects in integrated circuits.
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The following facts about the Tegal 915 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
Fewer than 3 independently cited specifications for the Tegal 915 are on record; the remainder await public documentation.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Tegal 915 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Tegal 915 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Tegal 915 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Tegal 915 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
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Last updated Oct 7, 2026.
The Applied Materials 0010-47763 is an electrostatic chuck (ESC) assembly used in semiconductor etching processes.
The Applied Materials 0010-16392 is an electrostatic chuck assembly designed for 300 mm wafer processing, featuring a dual electrode configuration.
Oxford Instruments 100 ICP Fluorine is an inductively coupled plasma etcher for fluorine-based etching, supporting cryo DRIE and multiple etch gases including SF6 and C4F8.