Tegal
90 X
What it is
How it works
General reference — not yet source-verifiedA plasma etcher removes material by generating a reactive plasma and directing that plasma chemistry at a wafer surface.
A plasma etch system is used for dry etch processing rather than wet chemical removal.
Where it fits in the process flow
The Tegal 90X platform was used for non-critical etch work in the production of ink-jet heads at Olivetti TechCenter.[3]
Applications
The Tegal 90X platform was used in integrated circuits, opto-telecom devices, and other related microelectronics devices.[3]
Why won't it start?
Documented failure modes, common issues, and field considerations.
- Missing parts
What do the numbers mean?
Configuration & options9
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- SPTS CPX Pegasus— Same function class: Etch, nullCompare in depthsource[3]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
How does this class of system achieve vertical sidewalls?General reference — not yet source-verified
The combination of directional ion bombardment and chemical etching in reactive ion etch systems allows for anisotropic etching, where material is removed faster in the vertical direction than laterally, producing steep sidewall profiles.
What maintenance is typical for such equipment?General reference — not yet source-verified
Regular maintenance includes cleaning the chamber to remove deposition buildup, replacing consumable parts such as electrodes or focus rings, and calibrating gas flow controllers and RF power delivery to maintain process repeatability.
What safety considerations are important for these systems?General reference — not yet source-verified
Operators must follow protocols for handling toxic and corrosive process gases, ensure proper grounding for RF energy, and use vacuum safety interlocks to prevent exposure to plasma or high voltages.
Not publicly documented
The following facts about the 90 X are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 90 X are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 90 X are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 90 X are not on record.
Answerable by: an engineer who operated it or OEM installation records
The process node or technology generation of the 90 X is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the 90 X are on record.
Answerable by: an OEM parts catalog or a service engineer
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]inventory listing
- [2]inventory listing
- [3]web.archive.org — tegal.com (Apr 26, 2001)web.archive.org
Last updated Sep 28, 2026.
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