SUSS MicroTec
FC 250
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The SUSS FC 250 is a die bonder for high-accuracy automated packaging of optoelectronic devices. The SUSS FC 250 provides sub-micron alignment accuracy, with alignment deviation of 1 µm at 3σ. The SUSS FC 250 can operate at temperatures up to 450°C and bonding forces from 10 gf to 200 kgf.[1]
What it is
How it works
The FC 250 uses optical alignment, a bonding arm, and heated chucks for flip-chip style attachment.[1]
Where it fits in the process flow
General reference — not yet source-verifiedThe FC 250 sits in back-end packaging and assembly rather than front-end wafer fabrication.
The FC 250 is suited to align, place, and bond chips to substrates for device assembly.
What do the numbers mean?
Wafer handling1
Optics & imaging3
Performance1
Configuration & options7
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Not publicly documented
The following facts about the FC 250 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the FC 250 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the FC 250 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the FC 250 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the FC 250 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the FC 250 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]web.archive.org — suss.com (Nov 6, 2002)web.archive.org
- [2]Inventory photo
- [3]FC 250 — SUSS MicroTec | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
Last updated Oct 11, 2026.
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