Semitool
Equinox
What it is
How it works
General reference — not yet source-verifiedIn the Equinox, wafers are spun inside a sealed chamber while process chemicals are sprayed onto the wafer surface through a manifold of nozzles. The machine can be configured for different chemistries depending on the etch or removal application.
What do the numbers mean?
Wafer handling1
Configuration & options9
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
How many chambers does the system have?
The system has a four-chamber capacity.[1]
Not publicly documented
The following facts about the Equinox are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Equinox are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Equinox are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Equinox are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Equinox are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Equinox is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]inventory listing
- [3]SEMITOOL : Our Products — semitool.com (Sep 21, 2007)web.archive.org
Last updated Sep 28, 2026.
Compare with similar tools
View all →The Applied Materials 0010-47763 is an electrostatic chuck (ESC) assembly used in semiconductor etching processes.
The Applied Materials 0010-16392 is an electrostatic chuck assembly designed for 300 mm wafer processing, featuring a dual electrode configuration.
Oxford Instruments 100 ICP Fluorine is an inductively coupled plasma etcher for fluorine-based etching, supporting cryo DRIE and multiple etch gases including SF6 and C4F8.
