Plasma-Therm
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The Versaline ICP Etcher includes a load lock chamber, a transfer chamber, and a process chamber with an electrostatic chuck for wafer handling and processing.[1]
The system configuration includes a DSE III module, an RF generator module, a monitor rack, and a chiller unit for temperature control.[1]
ICP etching is used in front-end-of-line and back-end-of-line processing for patterning dielectric and metal layers in integrated circuit fabrication.
Applications include deep silicon etching for MEMS, through-silicon vias, and other high-aspect-ratio structures requiring anisotropic profiles.
How individual machines were equipped when they appeared on the secondary market — as listed, per unit. These describe one specific machine, not the model in general.
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
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The following facts about the Unaxis Versaline ICP are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Unaxis Versaline ICP are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Unaxis Versaline ICP are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Unaxis Versaline ICP are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Unaxis Versaline ICP are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Unaxis Versaline ICP is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Sep 22, 2026.
The Applied Materials 0010-47763 is an electrostatic chuck (ESC) assembly used in semiconductor etching processes.
The Applied Materials 0010-16392 is an electrostatic chuck assembly designed for 300 mm wafer processing, featuring a dual electrode configuration.
Oxford Instruments 100 ICP Fluorine is an inductively coupled plasma etcher for fluorine-based etching, supporting cryo DRIE and multiple etch gases including SF6 and C4F8.