Plasma-Therm
Plate 01Plasma-Therm SLR770 ICP Etcher Demonstration - System Overview - Part 1
Plate 02Plasma-Therm SLR770 ICP Etcher Demonstration - Part 1
Plate 03Plasma-Therm SLR770 ICP Etcher Demonstration - Part 2
Plate 04Plasma-Therm SLR770 ICP Etcher Demonstration - Automatic Process Run
Plate 05Plasma-Therm SLR770 ICP Etcher Demonstration - Part 3
Plate 06Plasmatherm SLR-770 DRIE Bosch Process
Wafer size
2"
Vacuum
Vacuum load lock with wafer transfer robot[1]
Gas delivery
Total of eight MFC gas controllers[1]
The system uses a high-frequency RF-based inductively coupled plasma source capable of high-density plasma generation. It includes closed-loop pressure control, a turbo pump with roughing pump, and a thermal transfer module for cooling the substrate with helium backside thermal transfer together with computer-controlled substrate clamping.[1]
The tool has a total of eight MFC gas controllers and includes a water chiller.[1]
The system can process wafers from 2 inches to 8 inches depending on the installed process kit, and it is currently configured with a 3-inch kit.[1]
The listed gases used with the system are N2, O2, CHF3, Ar, CH4, Cl2, BCl3, and CF4.[1]
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
No research found yet — worked with this tool? Share what you know.
The following facts about the SLR-770 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the SLR-770 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the SLR-770 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the SLR-770 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the SLR-770 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the SLR-770 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Last updated Jul 29, 2026.
The Applied Materials 0010-47763 is an electrostatic chuck (ESC) assembly used in semiconductor etching processes.
The Applied Materials 0010-16392 is an electrostatic chuck assembly designed for 300 mm wafer processing, featuring a dual electrode configuration.
Oxford Instruments 100 ICP Fluorine is an inductively coupled plasma etcher for fluorine-based etching, supporting cryo DRIE and multiple etch gases including SF6 and C4F8.