Plasma-Therm
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The Plasma-Therm Shuttleline ICP Etcher is an inductively coupled plasma etcher. The Shuttleline ICP processes 6-inch wafers. The Shuttleline ICP is used for etching III-V materials.[1][2]

The Plasma-Therm Shuttleline ICP sits in the etch module of a semiconductor process flow.
The Shuttleline ICP is used after pattern definition to transfer the pattern into exposed films.
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The Plasma-Therm Shuttleline ICP is an inductively coupled plasma etcher.[1][2][3]
The Plasma-Therm Shuttleline ICP processes 6-inch wafers.[1][2][3]
The following facts about the Shuttleline ICP are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Shuttleline ICP are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Shuttleline ICP are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Shuttleline ICP are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Shuttleline ICP are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Shuttleline ICP is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 8, 2026.
The Applied Materials 0010-47763 is an electrostatic chuck (ESC) assembly used in semiconductor etching processes.
The Applied Materials 0010-16392 is an electrostatic chuck assembly designed for 300 mm wafer processing, featuring a dual electrode configuration.
Oxford Instruments 100 ICP Fluorine is an inductively coupled plasma etcher for fluorine-based etching, supporting cryo DRIE and multiple etch gases including SF6 and C4F8.