Plasma-Therm
790 RIE-PECVD
The Plasma-Therm 790 RIE-PECVD is a reactive ion etcher and plasma-enhanced chemical vapor deposition system. The Plasma-Therm 790 RIE-PECVD supports wafer sizes 2, 3, 4, 5, 6, 8, and 12 inch. The Plasma-Therm 790 RIE-PECVD is a single-chamber tool.[1][2]
Power
13.56 MHz RF package[3]
Vacuum
Turbo pump (10-5 Torr)[2]
Gas delivery
O2 (20sccm), CF4 (50 sccm), He (100sccm)[2]
Optics
Si (with Cr mask), TMDs, Graphene[2]
What it is
The Plasma-Therm 790 is a reactive ion etcher and plasma-enhanced chemical vapor deposition system. The system supports wafer sizes from 2 to 12 inches. The tool can handle process gases including CHF3, O2, H2, Ar, Cl2, HBr, CF4, and He.[2]
What do the numbers mean?
Power & electrical5
- 13.56 MHz RF package[3]
Vacuum & pumping8
Wafer handling1
Gas & chemistry5
Optics & imaging2
- Compatible Materials
- Si (to etch with Cr mask, use the ORANGE RIE batchtop), TMDs, and Graphene[2]
Control & software2
Configuration & options14
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- ConfigurationO2 (20sccm), CF4 (50 sccm), He (100sccm)[2]
- ConfigurationTurbo pump (10-5 Torr)[2]
- Configuration6 process gases[3]
- Configuration13.56 MHz RF package[3]
- Configuration360lps turbo pump[3]
- Voltage208V, 3 Phase[4]
- ConfigurationNeslab Thermo Flex 2500 chiller and Ruvac pump system[4]
- Configuration(1) RUVAC WSU 501 Vacuum Pump[5]
- Configuration(1) Leybold Trivac D40BCS Vacuum Pump[5]
- ConfigurationWith Controls & RUVAC W3U 501H Vacuum Pump[6]
- Process gas supply (right chamber)CHF3 (54sccm), O2 (20sccm), H2 (20sccm), Ar (50sccm)[2]
- Process gas supply (left chamber)Cl2 (20sccm), HBr (100sccm), O2 (20sccm), CF4 (50sccm), He (100sccm)[2]
- Turbo pump base pressure10-5 Torr[2]
- RF frequency13.56 MHz[3]
- Electrical input200-220 Vac[3]
- Number of process gases6[3]
- Turbo pump capacity360 lps[3]
- Voltage/phase208V, 3 phase[4]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the 790 RIE-PECVD are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 790 RIE-PECVD are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 790 RIE-PECVD are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 790 RIE-PECVD are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 790 RIE-PECVD are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 790 RIE-PECVD is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (7)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Inventory photo
- [3]Inventory photo
- [4]Inventory photo
- [5]inventory listing
- [6]inventory listing
- [7]inventory listing
Last updated Sep 22, 2026.
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