Ontrak
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The Ontrak DSS 200 Synergy Brush is a wet processing / clean tool. The Ontrak DSS 200 Synergy Brush is a post-CMP wafer cleaner. The Ontrak DSS 200 Synergy Brush is configured for 100-200mm substrate processing.[1][2]

The DSS-200 cleaner is used for post-CMP clean, pre-bond clean, pre-photo clean, advanced packaging applications, post-metal deposition, post-ILD deposition, post-scribe, and substrate manufacturing.[2]
The DSS-200 cleaner supports substrate configurations from 100 mm to 200 mm and can accommodate smaller wafers with custom-designed carriers.[2]
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The DSS 200 Synergy Brush is configured for 100 to 200 mm substrate processing and can accommodate smaller wafers with custom-designed carriers.[1][2]
The DSS-200 cleaner uses brush-scrub cleaning and spin plus heat-lamp drying.[2]
The DSS-200 cleaner supports NH4OH, dHF, SC-1, SC-2, backside chemical, metal CMP cleans, and STI CMP cleans.[2]
The following facts about the DSS 200 Synergy Brush are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DSS 200 Synergy Brush are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DSS 200 Synergy Brush are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DSS 200 Synergy Brush are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DSS 200 Synergy Brush are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DSS 200 Synergy Brush is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 7, 2026.
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