Waferpedia

Ontrak

DSS 200 Integrated Circuit

Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

The Ontrak DSS 200 is a double-sided PVA scrubber for cleaning wafers from 100mm to 200mm. The Ontrak DSS 200 is used for post-CMP cleaning, general cleaning, and silicon cleaning applications.[1][2][3]

OntrakDSS 200 Integrated Circuit
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What it is

The Ontrak DSS 200 is an integrated circuit cleaner that functions as a double-sided PVA scrubber designed to clean wafers ranging from 100mm to 200mm in diameter. The system is available in Series 1 and Series 2 configurations, both sharing a common double-sided brush scrub architecture.[4][1][2]

How it works

The Ontrak DSS 200 features a double-sided PVA scrub with dual brush boxes, ammonia dispense, and an IR-assisted spin dry station. The system includes a universal load station (Series 1) or a 200mm ergonomic load station (Series 2), a robotic unload, a vertical unload station, and touchscreen controls. The Series 2 adds dark plastic covers to protect light-sensitive wafers.[1][2]

Where it fits in the process flow

The Ontrak DSS 200 is specifically designed for post-CMP cleaning, with applications including oxide, polysilicon, nitride, tungsten, aluminum, and copper post-CMP clean. The system is also used for general purpose cleaning and silicon cleaning.[1][2]

Applications

The Ontrak DSS 200 is used for post-CMP clean, pre-bond clean, pre-photo clean, advanced packaging applications, post-metal deposition, post-ILD deposition, post-scribe, and substrate manufacturing. The Series 2 offers throughputs of 45-65 wafers per hour depending on the application.[2][3]

What do the numbers mean?

Wafer handling3

Wafer size range
100mm to 200mm[1]
Accurate?
Throughput
45-65 wafers per hour[2]
Accurate?
Robotic unload
Yes[1]
Accurate?

Control & software2

Control system
Windows-based[3]
Accurate?
Touchscreen controls
Yes[1]
Accurate?

Configuration & options5

Cleaning method
Double-sided PVA scrub[1]
Accurate?
Brush type
Roller PVA[3]
Accurate?
Drying method
Spin dry with heat lamp[1]
Accurate?
Brush boxes
Dual[1]
Accurate?
Ammonia dispense
Yes[1]
Accurate?

Vintage & configurations

Documented models & variants

DesignationGenerationVintageChangesSource
DSS 200 Series 1——Base variant; double-sided PVA scrubber for 100-200mm wafers.axustech.com[1]
DSS 200 Series 2——Offers throughput of 45-65 wafers per hour, dark plastic covers to protect light-sensitive wafers.axustech.com[2]
DSS 200 Series 2 CE——Cleaning method: brush scrub; brush type: roller PVA; downforce control: yes; edge scrub: optional; megasonic: optional; drying: spin + heat lamp; NH4OH: yes; dHF: no; SC-1 pre-diluted: yes; SC-2: citric-based; backside chemical: yes; metal CMP cleans: yes; STI CMP cleans: yes; double contained process area: no.entrepix.com[3]
DSS 200 Synergy——Cleaning method: brush scrub; brush type: roller PVA; downforce control: yes; edge scrub: optional; megasonic: optional; drying: spin + heat lamp; NH4OH: yes; dHF: yes; SC-1 pre-diluted: yes; SC-2: citric OR HCL-based; backside chemical: yes; metal CMP cleans: yes; STI CMP cleans: yes; double contained process area: yes.entrepix.com[3]
DSS 200 Integra——Cleaning method: brush scrub; brush type: roller PVA; downforce control: yes; edge scrub: optional; megasonic: optional; drying: spin + heat lamp; NH4OH: yes; dHF: yes; SC-1 pre-diluted: yes; SC-2: citric OR HCL-based; backside chemical: yes; metal CMP cleans: yes; STI CMP cleans: yes; double contained process area: yes; integrated megasonic.entrepix.com[3]
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Not publicly documented

Field notes

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Frequently asked questions

What wafer sizes does the Ontrak DSS 200 support?

The Ontrak DSS 200 is designed to clean wafers from 100mm to 200mm in diameter.[1][3]

What is the throughput of the Ontrak DSS 200 Series 2?

Depending on the application, throughputs of 45-65 waers per hour are attainable.[2]

What cleaning methods does the Ontrak DSS 200 use?

The Ontrak DSS 200 uses double-sided PVA brush scrubing with ammonia disense and an IR-assisted spin dry station for drying.[1][2]

Does the Ontrak DSS 200 have any special features for light-sensitive wafers?

The Series 2 configuration includes dark plastic covers to protect light-sensitive wafers.[2]

What type of control system does the Ontrak DSS 200 use?

The system features touchscreen controls. The modern Entrepix version uses a Windows-based control system with event logging and role-based access control.[1][2][3]

Not publicly documented

The following facts about the DSS 200 Integrated Circuit are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DSS 200 Integrated Circuit are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • The control-system platform and OS era of the DSS 200 Integrated Circuit are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the DSS 200 Integrated Circuit are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the DSS 200 Integrated Circuit is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the DSS 200 Integrated Circuit are on record.

    Answerable by: an OEM parts catalog or a service engineer

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Sources & citations

Sources (4)Every fact above is drawn from these public sources
  1. [1]axustech.com — axustech.comaxustech.com
  2. [2]axustech.com — axustech.comaxustech.com
  3. [3]entrepix.com — entrepix.comentrepix.com
  4. [4]Equipment inventory listing
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Last updated Sep 22, 2026.

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