Novellus

Sputtering systems are physical vapor deposition (PVD) tools used to deposit thin films of conductive or dielectric materials onto semiconductor wafers.
In sputter deposition, a plasma is created in a vacuum chamber, typically using an inert gas such as argon. Positive ions from the plasma bombard a target material, ejecting atoms that then travel to and condense on the wafer surface, forming a thin film.
The Novellus 3290 STQ includes a load lock and is configured without an RF etch position, with an installed heater for preheating rather than an RF base. The system is designed for sequential wafer processing in a batch or single-wafer mode depending on the configuration.[1]
The system is used for depositing metals such as aluminum, titanium, titanium nitride, and other materials used in interconnect, barrier, and contact layers.
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The system has DC power supplies: 12/12/12 kW at 208 V, with an option for 6/6/12 kW. The input voltage for the 12/12/12 kW AE Pinnacle option is 400 V.[1]
Yes, the system includes a touch screen control interface accessible from both sides.[1]
The system uses CTI cryo pumps and a Varian V70 turbo pump for the load lock.[1]
The system operates on 3-phase, 50 Hz electrical supply.[1]
The following facts about the 3290 STQ are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 3290 STQ are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 3290 STQ are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 3290 STQ are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 3290 STQ are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 3290 STQ is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 1, 2026.
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