LTX-Credence
TMT ASL 1000 165
What it is
General reference — not yet source-verifiedThe model designation is manufactured by LTX (now part of Credence, later Teradyne). The tester is used in final test and wafer sort applications within semiconductor manufacturing.
How it works
General reference — not yet source-verifiedATE systems like the TMT ASL 1000 165 operate by applying electrical stimuli to device under test (DUT) pins and measuring the resulting responses. The tester contains pin electronics that generate test patterns, compare outputs to expected values, and log results.
Such testers typically include a test head that interfaces with the DUT via a probe card or handler interface, a pattern generator for creating test vectors, and a timing system to synchronize signals. The architecture supports parametric and functional testing of digital, analog, or mixed-signal devices.
Where it fits in the process flow
General reference — not yet source-verifiedIn a semiconductor fab flow, the TMT ASL 1000 165 sits in the test and probe area. After wafer fabrication and dicing, devices undergo wafer sort (probe) to identify good dies, followed by final test after packaging.
What do the numbers mean?
Wafer handling1
- 8" Hot Chuck[1]
Configuration & options10
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- Advantest 93000 Smart Scale— Same function class: Test & Probe, UnknownCompare in depthsource[1]
- Teradyne J 750— Same function class: Test & Probe, UnknownCompare in depthsource[1]
- Advantest 93000 SOC— Same function class: Test & Probe, UnknownCompare in depthsource[1]
- Teradyne ETS 364— Same function class: Test & Probe, UnknownCompare in depthsource[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
How does testing at the wafer level differ from testing after packaging?General reference — not yet source-verified
Wafer-level testing makes contact through probe needles on a probe card, while packaged-device testing uses a socket or handler interface. The same class of tester can support either mode by changing the contact interface and test program.
What support items are needed to operate a system of this class?General reference — not yet source-verified
Operation normally requires test programs, a fixture or probe card, calibration references, and coordination with a prober or handler. Operator knowledge of the specific device specifications is also necessary.
What types of measurements can such a system make?General reference — not yet source-verified
Typical measurements include supply current, output voltage levels, timing characteristics, continuity, leakage, and functional logic behavior.
Is this class of equipment used only for high-volume production?General reference — not yet source-verified
No. Similar systems are used for engineering validation, yield debugging, and device characterization, as well as production screening.
Not publicly documented
The following facts about the TMT ASL 1000 165 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the TMT ASL 1000 165 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the TMT ASL 1000 165 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the TMT ASL 1000 165 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the TMT ASL 1000 165 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the TMT ASL 1000 165 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]inventory listing
Last updated Oct 9, 2026.
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The Advantest 93000 Smart Scale Tester is a semiconductor test system that includes a Z640 workstation and can be configured with STH or CTH thermal heads and various card types.
The Advantest 93000 SOC Tester is a system-on-chip tester referenced in sources with multiple configurations of infrared, digital, DC, and AC modules.
The Teradyne / Eagle ETS 364 Tester is a semiconductor test system with configurable analog and digital pin units.
General referenceTeradyne J 750 is a semiconductor test and probe system used for electrical evaluation of devices during manufacturing. It belongs to the class of automated test equipment that supports wafer or device-level screening before final assembly.