Lam Research
Rainbow 4526 I
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Lam Research Rainbow 4526 I is a dry etcher. The Rainbow 4526 I processes 6-inch (150 mm) wafers. The Rainbow 4526 I is a 'Classic' dry etcher.[1][2]
What it is
How it works
General reference — not yet source-verifiedA dry etcher removes material from a wafer surface by using a plasma or reactive gas process rather than liquid chemistry.
A dry etcher generally transfers patterned information into exposed films while unexposed regions remain protected by a mask or resist.
Where it fits in the process flow
General reference — not yet source-verifiedDry etching sits in the pattern-transfer stage of wafer fabrication after lithography has defined the areas to be opened.
Dry etching commonly follows film deposition or oxidation when a patterned layer must be selectively removed.
Applications
General reference — not yet source-verifiedA dry etcher is used for patterning semiconductor films on wafers.
A dry etcher is used for anisotropic material removal when vertical sidewalls and fine pattern transfer are needed.
What do the numbers mean?
Wafer handling2
Configuration & options3
- Classic[2]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What kind of wafers can be processed by machines of this class?General reference — not yet source-verified
Single-wafer plasma etch systems of this class are designed to process semiconductor wafers of a certain standard size, with robotic handling and a cassette interface for automatic loading and unloading.
How is etch rate controlled on this type of equipment?General reference — not yet source-verified
Etch rate is primarily controlled by plasma power, gas mixture, chamber pressure, and wafer temperature. Bias power is used to adjust ion energy, which influences both etch rate and anisotropy.
What endpoint detection methods are typically used?General reference — not yet source-verified
Common endpoint detection methods include optical emission spectroscopy, which monitors changes in plasma light emission as the film clears, and interferometry, which measures thin-film interference from the wafer surface.
What maintenance is required for plasma etch systems?General reference — not yet source-verified
Typical maintenance includes regular chamber cleaning to remove process residue, replacement of consumable parts such as focus rings and electrodes, and calibration of gas flow, pressure, and temperature sensors to maintain repeatable process control.
What safety considerations apply to this class of equipment?General reference — not yet source-verified
Plasma etch systems handle reactive and sometimes toxic gases, so safety interlocks, gas detection, and proper exhaust abatement are required. High-voltage radio-frequency power and vacuum systems also require appropriate safety protocols and operator training.
Not publicly documented
The following facts about the Rainbow 4526 I are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Rainbow 4526 I are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Rainbow 4526 I are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Rainbow 4526 I are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Rainbow 4526 I are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Rainbow 4526 I is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]fabsurplus.com — fabsurplus.comfabsurplus.com
- [2]inventory listing
- [3]Inventory photo
Last updated Oct 12, 2026.
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