Hitachi
M 318 NX Dry
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Hitachi M 318 NX is a dry etcher for semiconductor manufacturing. The Hitachi M 318 NX processes 6-inch wafers. The Hitachi M 318 NX was introduced in 1995.[1][2]
What it is
How it works
General reference — not yet source-verifiedDry etchers remove material from a wafer surface using a chemically reactive plasma. In a typical configuration, process gases are introduced into a vacuum chamber where a radio-frequency field ionizes them into a plasma. Energetic ions and reactive radicals generated in the plasma etch exposed areas of the wafer through a combination of physical bombardment and chemical reaction.
Where it fits in the process flow
General reference — not yet source-verifiedIn semiconductor fabrication, dry etch equipment is used after photolithography to transfer patterns into underlying films. The etched wafer proceeds to subsequent steps such as resist stripping, cleaning, and deposition of additional layers. The dry etch process is a critical step for defining device features with high anisotropy and selectivity.
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Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
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Frequently asked questions
Not publicly documented
The following facts about the M 318 NX Dry are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
Fewer than 3 independently cited specifications for the M 318 NX Dry are on record; the remainder await public documentation.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the M 318 NX Dry are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the M 318 NX Dry are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the M 318 NX Dry are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the M 318 NX Dry are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
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Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]Equipment inventory listing
- [2]M 318 NX Dry — Hitachi | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
Last updated Oct 1, 2026.
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