BJ 955

Bonders are machines used in semiconductor packaging to attach fine wires between the bond pads of a die and the terminals of a package or substrate. Wire bonding is a common interconnection method for integrated circuits. The BJ 955 belongs to this class of packaging equipment.

A wire bonder like the BJ 955 creates electrical connections by feeding a metal wire through a capillary tool. The machine forms a ball at the wire tip using an electrical flame-off or hydrogen flame, then presses that ball onto a heated bond pad with controlled force and ultrasonic energy. After forming the first bond, the capillary moves to the second bond location and repeats the process. The wire is then broken off, leaving a completed connection.

Two principal wire bonding techniques can be used: ball bonding and wedge bonding. Ball bonding is typically performed with gold wire and uses heat, ultrasonic vibration, and pressure. Wedge bonding uses aluminum wire and can be done at room temperature with ultrasonic energy alone. The specific technique employed by the BJ 955 is not specified in the available information.

The BJ 955 operates in the back-end semiconductor assembly process, after wafer dicing and die attachment and before encapsulation or molding. The bonding step connects the die to the leadframe or substrate. Following wire bonding, the assembled package proceeds to encapsulation, plating, and final test.

The BJ 955 is used for wire bonding in the packaging of integrated circuits. Typical applications include memory devices, logic chips, microcontrollers, and other semiconductor products that require gold or aluminum wire interconnects. The bonder can be employed in high-volume manufacturing of plastic molded packages, ceramic packages, and multi-chip modules.