EV Group
Gemini FB
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
How it works
The Gemini FB incorporates the SmartView NT3 face-to-face bond aligner, which achieves wafer-to-wafer alignment accuracy of sub 50 nm. The system can include up to six pre-processing modules, such as a clean module, a LowTemp plasma activation module, an alignment verification module, and optional debond or thermocompression bond modules. The system uses an XT Frame concept with an Equipment Frontend Module (EFEM). A platform extension introduced in 2011 raised the throughput to up to 20 wafers per hour.[1][2]
For collective die-to-wafer (Co-D2W) bonding, the system handles wafer and customized die carriers and aligns them using the SmartView NT aligner. The system includes software interfaces and integrated metrology functions for feed-forward and feedback loops to optimize overlay.[3]
Applications
What do the numbers mean?
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Not publicly documented
Field notes
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Frequently asked questions
What alignment accuracy does the SmartView NT3 aligner provide?
The SmartView NT3 face-to-face bond aligner achieves sub 50 nm wafer-to-wafer alignment accuracy.[1]
How many pre-processing modules can be integrated?
The system can integrate up to six pre-processing modules, in addition to the SmartView NT aligner.[1]
What is the maximum throughput of the Gemini FB platform extension?
A platform extension introduced in 2011 increased throughput to up to 20 wafers per hour.[2]
Can the Gemini FB be used for die-to-wafer bonding?
Yes, the Gemini FB can be configured for collective die-to-wafer (Co-D2W) bonding.[3]
What optional modules are available for the Gemini FB?
Optional modules include a debond module and a thermocompression bond module.[1]
Not publicly documented
The following facts about the Gemini FB are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No specifications for the Gemini FB are on record.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Gemini FB are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Gemini FB are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Gemini FB are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Gemini FB are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
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Sources & citations
Sources (4)Every fact above is drawn from these public sources
- [1]GEMINI® FB Automated Fusion Wafer Bonding System — evgroup.comevgroup.com
- [2]EV Group Launches New Flagship Model in Its GEMINI® FB Family of Fusion Wafer Bonding Systems to Enhance Throughput and Automation Performance — prnewswire.comprnewswire.com
- [3]GEMINI® FB Automated Fusion Wafer Bonding System Configured for Die-to-Wafer Bonding — evgroup.comevgroup.com
- [4]Equipment inventory listing
Last updated Sep 27, 2026.
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