EV Group
EVG 150
The EVG 150 is a modular cluster tool for coating and development of i-line photoresists. The EVG 150 handles standard SEMI-wafers of 100mm and 150mm diameter. The EVG 150 includes three spin-coating modules, a development module, and hotplate/coolplate stacks.[1]
Plate 01EVG 150 Automated Coater / Developer Processing System (ID#3940)
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Wafer size
100mm
Gas delivery
Low-viscosity photoresist[1]
What it is
The EVG 150 is a modular cluster tool for coating and development of i-line photoresists.[1]
It is equipped with two loading and unloading ports, an optical wafer centering station, three spin-coating modules, one development module with puddle and spray options, three stacks of hotplates and coolplates, and an additional HMDS-priming module.[1]
How it works
The individual processing modules are fed by a dual end effector robot.[1]
Sequences consist of sub-recipes running in individual modules. Several sequences can be active in parallel, and the flow is managed in real time by software and optimized for maximum throughput or for prioritization of critical steps.[1]
Process stability is enhanced by an airborne molecular contamination filter on top of the tool and by active control of chamber and resist/developer line temperature.[1]
Where it fits in the process flow
The tool handles standard SEMI wafers of 100 mm and 150 mm diameter, including opaque wafers such as silicon and SOI and transparent wafers such as glass, fused-silica, and sapphire.[1]
Its process flow library includes coating sequences, development sequences, cleaning, and maintenance sequences. The coating options include surface preparation by HMDS, dehydrate, or none, and solvent clean by standard or edge bead removal.[1]
Applications
The EVG 150 is used for photoresist coating and development processes in i-line photolithography.[1]
Photoresists currently available on the tool include AZ ECI 3007, AZ ECI 3027, AZ 1512 HS, AZ nLOF 2020, AZ nLOF 2070, and MC PC62E. Bottom layers currently available include LOR 5A, LOR 15C, and XHRiC-16 II.[1]
The available developer chemistries are metal ion free TMAH-based AZ 726 MIF, metal ion containing KOH-based AZ 400K 1:3.5, and aluminum-friendly sodium metasilicate/phosphate-based AZ developer III.[1]
- Photoresist coating
- Photoresist development
- Bottom layer coating
What do the numbers mean?
Wafer handling15
- Loading/unloading ports
- Two loading/unloading ports: one cassette for coating and one cassette for development[1]
- Substrate types
- Opaque wafers (silicon, SOI) or transparent wafers (glass, fused-silica, sapphire)[1]
- Wafer types
- Standard SEMI wafers of 100mm and 150mm diameter, opaque (silicon, SOI) or transparent (glass, fused-silica, sapphire)[1]
- Wafer types
- Opaque wafers (silicon, SOI) and transparent wafers (glass, fused-silica, sapphire)[1]
Gas & chemistry9
- Process stability features
- Airborne molecular contamination (AMC) filter and active control of chamber and resist/developer lines temperature[1]
- process enhancement
- AMC filter and active control of chamber and resist/developer line temperature[1]
- Process enhancement
- Airborne molecular contamination filter and active control of chamber and resist/developer line temperature[1]
Configuration & options28
- Hotplates and coolplates
- Three stacks of hotplates (8 in total) and coolplates (3 in total)[1]
- Available photoresists
- AZ ECI 3007, AZ ECI 3027, AZ 1512 HS, AZ nLOF 2020, AZ nLOF 2070, MC PC62E[1]
- spin-coating modules
- Three (coater A: low-viscosity PR, coater B: high-viscosity PR, coater C: bottom layers)[1]
- Spin-coating modules
- Three modules: coater A (low-viscosity PR), coater B (high-viscosity PR), coater C (bottom layers)[1]
- Photoresists available
- AZ ECI 3007, AZ ECI 3027, AZ 1512 HS, AZ nLOF 2020, AZ nLOF 2070, MC PC62E; bottom layers: LOR 5A, LOR 15C, XHRiC-16[1]
- Spin-coating modules
- 3 (coater A for low-viscosity PR, coater B for high-viscosity PR, coater C for bottom layers)[1]
- Hotplates and coolplates
- Three stacks of hotplates (8 in total) and coolplates (3 in total), including HMDS-priming module[1]
What replaced it?
Related models
- siblingHamatech HMR900source[1]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- Coater A useLow-viscosity photoresist[1]
- Coater B useHigh-viscosity photoresist[1]
- Process stability featuresAirborne molecular contamination (AMC) filter and active control of chamber and resist/developer lines temperature[1]
- Solvent clean optionsStandard or edge bead removal (EBR)[1]
- Developer chemistriesAZ 726 MIF, AZ 400K 1:3.5, AZ developer III[1]
- process enhancementAMC filter and active control of chamber and resist/developer line temperature[1]
- Temperature controlActive control of chamber and resist/developer lines temperature[1]
- Photoresist typei-line[1]
- Process enhancementAirborne molecular contamination filter and active control of chamber and resist/developer line temperature[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What type of equipment is the EVG 150?
It is a modular cluster tool for coating and development of i-line photoresists.[1]
What wafer sizes can it handle?
It handles standard SEMI wafers of 100 mm and 150 mm diameter.[1]
What process modules are included?
It includes two loading and unloading ports, an optical wafer centering station, three spin-coating modules, one development module with puddle and spray options, three stacks of hotplates and coolplates, and an additional HMDS-priming module.[1]
Which process steps are supported in the flow library?
The flow library includes coating, development, cleaning, and maintenance sequences.[1]
Which developer chemistries are available?
The available developer chemistries are AZ 726 MIF, AZ 400K 1:3.5, and AZ developer III.[1]
Not publicly documented
The following facts about the EVG 150 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the EVG 150 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the EVG 150 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the EVG 150 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the EVG 150 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the EVG 150 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]epfl.ch — epfl.chepfl.ch
- [2]EV Group - 产品 — evgroup.com (Sep 6, 2005)web.archive.org
Last updated Oct 8, 2026.
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