EV Group
620 BA
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The EVG®620 BA is an automated bond alignment system for wafer-to-wafer alignment for research and pilot production. The EVG®620 BA supports alignment of double or triple wafer stacks up to 150 mm wafer sizes. The EVG®620 BA provides alignment accuracies of ±2 µm (3σ) for backside alignment and ±1 µm (3σ) for transparent alignment.[1]
What it is
The EVG 620 BA is an automated bond alignment system for wafer-to-wafer alignment, intended for research and pilot production.[1]
Bond alignment systems are used to align wafers to each other before they are permanently bonded together. The EVG 620 BA is designed for use with EVG 501, EVG 510, and EVG 520 IS bonding systems.[1][2][3]
How it works
The EVG 620 BA supports bond alignment of double or triple wafer stacks up to 150 mm wafer sizes.[1][2][3]
The alignment stage uses precision micrometers for manual adjustment, with optional motorized micrometers and automated wedge compensation.[1][3]
The system includes fully motorized high-resolution bottom-side microscopes and a Windows-based user interface.[1]
Where it fits in the process flow
In wafer bonding processes, the EVG 620 BA is used to align device wafers to capping wafers or membrane wafers prior to permanent bonding, such as sealing or encapsulation in MEMS fabrication.[2]
Applications
What do the numbers mean?
Wafer handling3
Optics & imaging1
Performance5
- Alignment stage
- Manual precision micrometers, optional motorized, automated wedge compensation[1]
Control & software1
Dimensions & facilities1
Configuration & options2
- Desktop with optional system rack[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
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Frequently asked questions
What wafer sizes does the EVG 620 BA support?
The EVG 620 BA supports wafer sizes of 2 inch, 3 inch, 100 mm, and 150 mm.[1]
What is the alignment accuracy of the EVG 620 BA?
The EVG 620 BA offers backside alignment accuracy of ±2 µm 3σ and transparent alignment accuracy of ±1 µm 3σ.[1]
How many cassette stations does the standard handling system include?
The standard handling system includes 3 cassette stations, with an optional configuration supporting up to 5 stations.[1]
Not publicly documented
The following facts about the 620 BA are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 620 BA are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 620 BA are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 620 BA are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 620 BA are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 620 BA is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (4)Every fact above is drawn from these public sources
- [1]evgroup.com — evgroup.comevgroup.com
- [2]EVG®620 BA — ies.co.ukies.co.uk
- [3]EVG®620 BA by EV Group Europe & Asia/Pacific GmbH (EVG) | Albus — diagon.aidiagon.ai
- [4]Equipment inventory listing
Last updated Sep 29, 2026.
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