Disco
Dicing
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Disco dicing saw is a semiconductor dicing tool capable of handling up to 8 inch substrates. The Disco dicing saw uses a 2” front-mount spindle with closed-loop control and a pattern recognition system for auto-focusing.[1]
What it is
General reference — not yet source-verifiedDisco dicing equipment is a wafer separation tool used to cut semiconductor substrates into individual devices after front-end fabrication. The equipment class belongs to the packaging and backend portion of semiconductor manufacturing, where processed wafers are separated for later assembly.
How it works
The Cornell DISCO tool uses a front-mount spindle with air drive and closed-loop control. The tool also uses a closed-loop Y-axis linear encoder, non-contact optical height sensing, and a pattern recognition system with auto-focusing and programmable illumination.[1]
Where it fits in the process flow
The Cornell tool is used with all-purpose and silicon-only blade schedules, which indicates use for different substrate and cut requirements. The tool is also used for dicing silicon, bonded silicon wafers, and glass.[1]
Applications
General reference — not yet source-verifiedDicing equipment is used for semiconductor wafer singulation and for cutting other microelectronic substrates that are processed in wafer form. The class is also used with support tapes that hold the substrate during separation and later pickup.
What do the numbers mean?
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| DAD3220 | — | — | Automatic dicing saw with auto-alignment, auto-focus, auto-kerf check, 4 cutting channels with 320 degree max rotating angle, cutting blades thickness 100-400 micron, max substrate size 6” wafers or 6”x6” substrates, 160mm x 162mm cutting range, <0.005/160 positioning accuracy, 1.5 kW spindle at 30,000 per minute. | ece.utoronto.ca[3] |
Where are the manuals?
Publicly hosted documents referencing this tool, linked at their original location. Hosted by the linked institutions — availability may change.
- Flyer for dicing saw and tape applicatorDocumenttamu.edu
- Standard Operating Procedure for Disco Dicing Saw and Tape ApplicatorSOPtamu.edu
- ManualManualuic.edu
- CNS Consolidated RatesDocumentharvard.edu
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What is the maximum substrate size the Disco Dicing Saw can handle?
The tool can handle substrates up to 8 inches in size.[3]
What is the maximum substrate thickness allowed?
The maximum substrate thickness is 1.25 mm.[3]
What materials can be processed with this dicing saw?
The tool is compatible with Class A and B metals and compounds, but does not allow GaAs substrates.[3]
What is the role of dicing tape in the dicing process?
Dicing tape holds the wafer or die together during cutting, and is mounted to a thin metal frame for support.[4]
Not publicly documented
The following facts about the Dicing are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Dicing are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the Dicing are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Dicing are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Dicing is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the Dicing are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (18)Every fact above is drawn from these public sources
- [1]cnfusers.cornell.edu — cnfusers.cornell.educnfusers.cornell.edu
- [2]inventory listing
- [3]ece.utoronto.ca — ece.utoronto.caece.utoronto.ca
- [4]Dicing tape - Wikipedia — en.wikipedia.orgen.wikipedia.org
- [5]Dicing - Wikipedia — en.wikipedia.orgen.wikipedia.org
- [6]Packaging Lab | Quantum-Nano Fabrication and Characterization Facility | University of Waterloo — uwaterloo.cauwaterloo.ca
- [7]Packaging – Miscellaneous ‒ Center of MicroNanoTechnology CMi ‐ EPFL — epfl.chepfl.ch
- [8]Equipment Page | Utah Nanofab — nanofab.utah.edunanofab.utah.edu
- [9]Nanoscribe Photonics GT2 high-resolution 3D printer - AggieFab Nanofabrication Facility — aggiefab.tamu.eduaggiefab.tamu.edu
- [10]MNTC - Equipment and Facilities | Service Centers — louisville.edulouisville.edu
- [11]Disco Automatic Dicing Saw | Nanotechnology Core Facility | University of Illinois Chicago — ncf.uic.eduncf.uic.edu
- [12]Disco 321 Wafer Dicing Saw — tmi.utexas.edutmi.utexas.edu
- [13]Disco DFL7340 Stealth Dicer - Equipment - nanoFAB Confluence — confluence.nanofab.ualberta.caconfluence.nanofab.ualberta.ca
- [14]Bonding & Packaging — nanolab.berkeley.edunanolab.berkeley.edu
- [15]Dicing Saw | Shared Materials Instrumentation Facility — smif.pratt.duke.edusmif.pratt.duke.edu
- [16]CNS Consolidated Rates — cns1.rc.fas.harvard.educns1.rc.fas.harvard.edu
- [17]Packaging & Assemby — tudelft.nltudelft.nl
- [18]DBG・封装元件基板的分割 - DISCO Corporation — disco.co.jp (Feb 22, 2020)web.archive.org
Last updated Oct 6, 2026.
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