Disco
DFG 850 Back
The Disco DFG 850 is a back grinder for semiconductor wafers. The Disco DFG 850 uses air-bearing spindles with a maximum speed of 7,000 RPM. The Disco DFG 850 requires 200-208 V, 50/60 Hz, 3-phase power and is water cooled.[1]
What it is
How it works
General reference — not yet source-verifiedA back grinder typically holds the wafer on a porous vacuum chuck while a rotating grinding wheel removes material from the back side. The process may involve multiple grinding steps with progressively finer abrasives, followed by a wet or dry polish to achieve the target thickness and surface finish.
Where it fits in the process flow
General reference — not yet source-verifiedTypical upstream steps include final cleaning and inspection of the front-side structures. Downstream steps include dicing, die attach, wire bonding, and encapsulation.
What do the numbers mean?
Power & electrical1
Vacuum & pumping3
- Disco DVC 011 Vacuum Coolant Unit[1]
Wafer handling1
Dimensions & facilities1
Configuration & options2
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What type of spindle does the DFG 850 use?
The DFG 850 uses an air-bearing spindle.[1]
What is the maximum spindle speed of the DFG 850?
The maximum spindle speed is 7,000 RPM.[1]
How is the spindle cooled on the DFG 850?
The spindle is water cooled.[1]
Is there a vacuum coolant unit included with the DFG 850?
The DFG 850 is equipped with a Disco DVC 011 vacuum coolant unit.[1]
Not publicly documented
The following facts about the DFG 850 Back are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DFG 850 Back are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DFG 850 Back are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DFG 850 Back are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DFG 850 Back are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DFG 850 Back is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (7)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Inventory photo
- [3]Inventory photo
- [4]Inventory photo
- [5]Inventory photo
- [6]Inventory photo
- [7]Equipment inventory listing
Last updated Oct 3, 2026.
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