Disco
DAD 340 Wafer
The Disco DAD 340 Wafer is a wafer dicing saw used for semiconductor singulation. The Disco DAD 340 Wafer operates on 1 Phase, 60 Hz, 20 Amp, and 208 V.[1][2]
What it is
How it works
General reference — not yet source-verifiedWafer dicing and grinding machines use a rotating abrasive blade or wheel to cut and remove material from a semiconductor wafer. The wafer is mounted on a chuck table that moves the wafer relative to the spindle axis, allowing precise control of cut depth and position.
Where it fits in the process flow
General reference — not yet source-verifiedThe dicing and grinding process step is a back-end operation that occurs after all front-end device fabrication steps are complete on the wafer. The wafer must contain functional device structures before being placed into the dicing saw.
Applications
General reference — not yet source-verifiedDicing and grinding machines are used on processed semiconductor wafers that contain device patterns, primarily silicon but also other brittle substrates such as silicon carbide, gallium arsenide, and glass. The class is intended for precision-engineered substrates that require careful mechanical processing to preserve die integrity.
What do the numbers mean?
Power & electrical4
- 20 Amp[1]
Configuration & options1
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- Accretech SS 20 Automatic Dicing— Same function class: Dicing & Grinding, nullCompare in depthsource[1]
- Strasbaugh 7 AF Back— Same function class: Dicing & Grinding, nullCompare in depthsource[1]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the DAD 340 Wafer are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DAD 340 Wafer are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DAD 340 Wafer are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DAD 340 Wafer are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DAD 340 Wafer are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DAD 340 Wafer is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]waferpedia.com — waferpedia.comwaferpedia.com
Last updated Oct 6, 2026.
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