Disco
DAD 3231 Automatic Dicing
The Disco DAD 3231 is an automatic dicing saw designed for processing 6-inch workpieces. The DAD 3231 features a single spindle with a rated output of 2.0 kW at 40,000 min-1. The machine includes automatic alignment, auto focus, and auto kerf check.[1]
Power
2.0 kW Non-Siezing Air Bearing Spindle[2]
Performance
Alignment Vision System[2]
Optics
0.000002 mm[1]
What it is
General reference — not yet source-verifiedDicing saws are precision cutting machines used in semiconductor manufacturing to separate individual dies from a wafer. The saw uses a rotating blade with diamond grit to cut along predefined streets.
How it works
The X-axis cutting range is 210 mm with a speed of 0.1 to 800 mm/s. The Y-axis has an index step of 0.0001 mm. The Z-axis maximum stroke is 31.2 mm with a moving resolution of 0.000002 mm. The θ-axis can rotate up to 320 degrees.[1]
Where it fits in the process flow
General reference — not yet source-verifiedDicing saws are employed after wafer thinning and before die attach in the semiconductor packaging process. The machine separates individual integrated circuit dies from a wafer by cutting through the wafer along scribe lines.
Applications
General reference — not yet source-verifiedCommon applications include silicon wafer dicing for integrated circuits, singulation of compound semiconductor substrates, and cutting of brittle materials such as ceramic substrates or glass panels. The machine's vision system enables alignment for various workpiece patterns.
What do the numbers mean?
Power & electrical2
Optics & imaging1
Performance5
Control & software1
- GUI Touch Screen Operating System[2]
Dimensions & facilities2
Configuration & options18
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the DAD 3231 Automatic Dicing are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DAD 3231 Automatic Dicing are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DAD 3231 Automatic Dicing are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DAD 3231 Automatic Dicing are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DAD 3231 Automatic Dicing are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DAD 3231 Automatic Dicing is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]web.archive.org — disco.co.jp (Apr 11, 2026)web.archive.org
- [2]Inventory photo
Last updated Oct 2, 2026.
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