Disco
DAD 321 Wafer Dicing
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Disco DAD 321 is a wafer dicing saw designed for dicing semiconductor wafers. The DAD 321 supports 6-inch wafer sizes.[1][2]
What it is
How it works
General reference — not yet source-verifiedThe blade is positioned by precision motion stages that move the wafer in the X, Y, and theta axes while the spindle rotates at high speed.
Deionized water is typically sprayed onto the cut zone to cool the blade and remove debris during the dicing process.
Where it fits in the process flow
General reference — not yet source-verifiedUpstream processes include wafer grinding and polishing to achieve the required thickness before dicing.
Downstream processes include die sorting, pick-and-place, and wire bonding or flip-chip assembly.
Applications
General reference — not yet source-verifiedThe machine can also be employed for dicing substrates used in MEMS devices, LEDs, and power semiconductors.
What do the numbers mean?
Wafer handling1
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What wafer sizes does the Disco DAD 321 support?
The Disco DAD 321 supports wafer sizes up to 6 inches.[1]
Not publicly documented
The following facts about the DAD 321 Wafer Dicing are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
Fewer than 3 independently cited specifications for the DAD 321 Wafer Dicing are on record; the remainder await public documentation.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DAD 321 Wafer Dicing are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DAD 321 Wafer Dicing are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DAD 321 Wafer Dicing are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DAD 321 Wafer Dicing are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]Equipment inventory listing
- [2]DAD 321 Wafer Dicing — Disco | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
Last updated Sep 28, 2026.
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