Disco
6362 Automatic Dicing
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
How it works
General reference — not yet source-verifiedDicing saws separate individual semiconductor die from a wafer by mechanical cutting. The saw uses a high-speed rotating spindle mounted with an annular diamond blade. During operation, the wafer is secured on a vacuum chuck and moved under the blade by precision X-Y stages, while a water jet cools the cut and removes debris. Automatic alignment systems use pattern recognition to locate scribe lines before cutting.
Where it fits in the process flow
General reference — not yet source-verifiedDicing saws are used in the backend of semiconductor fabrication, after wafer thinning and before die attach or packaging. The dicing step is typically performed on a film frame mounted on a tape ring to hold the singulated die in place after cutting. Upstream processes include grinding and polishing; downstream steps include pick-and-place assembly and wire bonding.
Applications
General reference — not yet source-verifiedThe machine is applied to singulate silicon wafers, compound semiconductor substrates, and other material substrates in the production of integrated circuits, MEMS devices, LEDs, and discrete components.
What do the numbers mean?
Power & electrical4
Configuration & options4
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What electrical power does the Disco 6362 require?
The machine requires 3-phase power at 50/60 Hz, with a voltage range of 308–415 VAC ±10%, 3-phase. The full load current is 9 A, the main breaker rating is 20 A, and the largest load draws 4 A.[1]
Not publicly documented
The following facts about the 6362 Automatic Dicing are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 6362 Automatic Dicing are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 6362 Automatic Dicing are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 6362 Automatic Dicing are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 6362 Automatic Dicing are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 6362 Automatic Dicing is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]waferpedia.com — waferpedia.comwaferpedia.com
- [2]Equipment inventory listing
Last updated Sep 26, 2026.
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