CHA
The CHA 1000 E-Beam is a deposition evaporator. The CHA 1000 E-Beam includes a 24 x 30" stainless steel bell jar. The CHA 1000 E-Beam includes a CTI 10 cryopump with lines, cable and compressor.[1][2]

The CHA 1000 E-Beam is an electron-beam deposition system in the CHA 1000 family.[2]
The CHA 1000 E-Beam evaporator is an e-beam evaporator platform with a 24 by 30 inch stainless steel bell jar, a 4 pocket gun, a lift off dome, a CTI 10 cryopump with lines, cable and compressor, a two stage direct drive roughing pump, a new touch screen valve controller, a new ion and thermocouple gauge, and a new thickness monitor.[1][2]
The CHA 1000 E-Beam sits in the physical vapor deposition stage of a semiconductor process flow.
The CHA 1000 E-Beam is used after substrate preparation and before later patterning or integration steps that require deposited thin films.
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The following facts about the 1000 E-Beam are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 1000 E-Beam are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 1000 E-Beam are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 1000 E-Beam are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 1000 E-Beam are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 1000 E-Beam is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 5, 2026.
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