CEE
300 X Spin
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
How it works
The CEE 300 X Spin supports a variety of process parameters including pre-wet steps, snap spin, ramp to spin profiles of 1 second or 5 seconds, exhaust control, and static or dynamic dispense methods.[2]
The CEE 300 X Spin can be configured with a sealed lid to maintain a solvent-rich environment in the bowl, preventing premature drying of the coating material.[2]
The CEE 300 X Spin can be used with an IDI Model 450 pump or an IDI 600 pump for material dispense, depending on the application requirements.[2]
Applications
The CEE 300 X Spin has been characterized for coating Shipley 1813 photoresist to a total thickness variation of 0.61% at a target thickness of 1.28 microns on 300 mm silicon wafers.[2]
The CEE 300 X Spin has been characterized for coating AZ 4620 photoresist to a total thickness variation of 0.63% at a target thickness of 9.11 microns on 300 mm silicon wafers.[2]
The CEE 300 X Spin has been characterized for coating SU-8 3025 permanent epoxy negative photoresist to a total thickness variation of 1.81% at a target thickness of 39.49 microns on 300 mm silicon wafers.[2]
The CEE 300 X Spin has been characterized for coating AZ 5214 image reversal photoresist to a total thickness variation of 0.84% at a target thickness of 1.64 microns on 300 mm silicon wafers.[2]
What do the numbers mean?
Wafer handling1
Configuration & options1
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Not publicly documented
The following facts about the 300 X Spin are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
Fewer than 3 independently cited specifications for the 300 X Spin are on record; the remainder await public documentation.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 300 X Spin are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 300 X Spin are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 300 X Spin are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 300 X Spin are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]costeffectiveequipment.com — costeffectiveequipment.comcosteffectiveequipment.com
Last updated Oct 7, 2026.