Besi

2200 EVO Plus

Packaging & Bonding Besi 2200 family

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2200 EVO Plus — Inventory photo — Fig. 012200 EVO PlusInventory photo^[1]

Performance

± 7 µm @ 3s^[5]

Optics

365 nm & 405 nm^[5]

What it is

The Besi 2200 EVO Plus is a die bonder for semiconductor packaging and bonding.^[1]^[5]^[6]^[7]

The 2200 EVO Plus belongs to Besi's Datacon 2200 evo plus die bonder line for multi module attach and die attach use.^[5]

How it works

The Datacon 2200 evo plus uses integrated dispensing, automatic wafer and tool changing, vision alignment, and an open platform architecture for customization.^[5]

Where it fits in the process flow

The Datacon 2200 evo plus supports die attach, flip chip, and multi chip assembly on substrates, carriers, leadframes, and other package-related supports.^[5]^[8]

Applications

The Datacon 2200 evo plus supports epoxy dispensing and stamping, soldering, thermo-compression, eutectic attachment, and flip chip dipping.^[5]

What do the numbers mean?

Wafer handling2

Wafer size: 4" - 12" (SEMI M1)^[5]
Substrate working range: 13” x 8” (325 mm x 200 mm)^[5]

Optics & imaging1

UV curing: 365 nm & 405 nm^[5]

Performance5

X/Y placement accuracy: ± 7 µm @ 3s^[5]
Theta placement accuracy: ± 0.10° @ 3s^[5]
Die attach throughput: up to 7,000 UPH/module^[5]
Flip chip throughput with dipping: up to 2,500 UPH/module^[5]
Flip chip throughput without dipping: up to 3,200 UPH/module^[5]

Dimensions & facilities2

Machine dimensions (LxDxH): 1,160 mm x 1,225 mm x 1,750 mm^[5]
Weight: 1,300 kg^[5]

Configuration & options9

Buffer Line Input^[4]; Buffer Line Output^[4]; Dual Head^[4]; No flip-chip option^[4]
Make: Besi / Datacon^[1]
Model: 2200 EVO Plus^[1]
Bond Force: 0.5N to 75N programmable^[5]
Heated bond head: up to 450°C (optional)^[5]
Frame size: FF070, FF105, FF108, FF123; automatic change (others on request)^[5]

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Where are the manuals?

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Not publicly documented

Field notes

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Frequently asked questions

What process roles does the Datacon 2200 evo plus support?

The Datacon 2200 evo plus supports die attach, flip chip, and multi chip assembly.^[5]

Not publicly documented

The following facts about the 2200 EVO Plus are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 2200 EVO Plus are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 2200 EVO Plus are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 2200 EVO Plus are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 2200 EVO Plus are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 2200 EVO Plus is not on record.
Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (8)Every fact above is drawn from these public sources

[1]Inventory photo
[2]Inventory photo
[3]Inventory photo
[4]waferpedia.comwaferpedia.com
[5]besi.com — besi.combesi.com
[6]2200 EVO Plus Die Bonder Hybrid — Besi | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
[7]Datacon 2200 evo plus - BE Semiconductor Industries N.V. | Die Bonder — semiconductor.directorysemiconductor.directory
[8]Product details | Besi — besi.combesi.com