ASML
The ASML PAS 5500 is a step-and-repeat projection stepper for photolithography. The PAS 5500 uses reduction optics, typically 5X or 4X, to transfer mask patterns onto wafers. The PAS 5500 family includes i-line (365 nm) and DUV (248 nm) models, with resolutions from 450 nm down to below 200 nm.[1][2][3][4]

Plate 01PAS 5500 – The Inside Story (1993) | ASML
Plate 02ASML PAS 5500 750 + TEL Act 8 Bundle Available, Wafer size 200mm, Location Asia
Plate 03ASML's The PAS5500 Revolution | Follow for full video.
Wafer size
200mm
Produced
2000–2010
Node / era
280 nm
Performance
Topside and backside alignment[3]
Optics
365 nm[1]
The ASML PAS 5500 series includes both i-line and deep-ultraviolet (DUV) variants. The PAS 5500/275D is an i-line stepper operating at 365 nm with 280 nm resolution and 40 nm overlay accuracy. The PAS 5500/60 is also an i-line system achieving 450 nm resolution and 90 nm overlay. The PAS 5500/350C is a DUV stepper using a KrF excimer laser at 248 nm, with resolution below 180 nm and overlay below 30 nm. The PAS 5500/300 uses 248 nm DUV light, capable of resolving dense features below 200 nm and isolated lines below 150 nm.[1][2][3][4]
The PAS 5500 series uses a wafer handler to load wafers from cassettes and a prealigner for centering. The wafer stage, constructed from Zerodur for low thermal expansion, is positioned using multiple interferometers for nanometer-scale accuracy. A level sensor measures wafer height and tilt to maintain focus during exposure. The system can expose fields of various sizes depending on the reticle and lens configuration.[3]
Process applications and technology nodes documented for this tool.
Documented failure modes, common issues, and field considerations.
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| PAS 5500/275D | i-line | — | High-throughput i-line stepper using 365 nm light; 5X reduction and projection capability; automated wafer handling for substrates from 200 mm diameter wafers down to small pieces. | nist.gov[1] |
| PAS 5500/60 | i-line | — | Automatic 100 mm wafer cassette processing capability; 365 nm near-UV light; minimum feature size of 450 nm; 150 mm capable with advanced notice. | snfguide.stanford.edu[2] |
| PAS 5500/350C | — | 2000–2010 | DUV photolithography stepper using 248 nm KrF laser source; 4x or 5x reduction; high throughput; handles 100 mm wafers by default and 150 mm on request. | epfl.ch[3] |
| PAS 5500/300 | DUV | — | Described as a DUV stepper configured for 4-inch wafers. | wiki.nanotech.ucsb.edu[4] |
| PAS 5500/200 | i-line | — | Described as a 5X reduction, i-line stepper for 6 inch wafers using 6 inch reticles, with 350 nm resolution, 0.48-0.60 variable numerical aperture, 22x22 mm maximum field size, and better than 50 nm overlay capability. | manualslib.com[6] |
| PAS 5500/400 | Step & Scan | 1995 | Described as the second step & scan system released by ASML, with a 4X reduction ratio and maximum long-term mask overlay of 35 nm. | chiphistory.org[5] |
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
Publicly hosted documents referencing this tool, linked at their original location. Hosted by the linked institutions — availability may change.
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It uses 365 nm wavelength light.[1]
It is capable of 280 nm resolution.[1]
The tool supports 75 mm, 100 mm, 150 mm, and 200 mm wafers, and small pieces can be processed on carrier wafers.[1]
It uses DUV light from a KrF laser source at 248 nm.[3]
The following facts about the PAS 5500 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
The control-system platform and OS era of the PAS 5500 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented compatible parts, consumables, or accessories for the PAS 5500 are on record.
Answerable by: an OEM parts catalog or a service engineer
Last updated Oct 8, 2026.
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