ASML
5500 300 C
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The ASML PAS 5500/300C is a deep ultraviolet (DUV) lithography stepper that handles 8-inch wafers. The ASML PAS 5500/300C processes 88 200 mm wafers per hour. The ASML PAS 5500/300C incorporates an AERIAL Illuminator that allows extendibility beyond 0.25 µm.[1]
What it is
The ASML 5500 300 C is a stepper, a type of photolithography tool used in semiconductor manufacturing. The 5500 model series is part of ASML's PAS 5500 product family. The designation "300 C" indicates a specific configuration within the step-and-repeat platform. The system is designed to process wafers up to 8 inch (200 mm) in diameter. The 5500 300 C supports a software release of 6.2 and higher, with the actual software release being 6.2.3.[2][1]
How it works
The stepper uses an alignment system to ensure each layer is correctly positioned relative to previous layers. The PAS 5500 family employed a phase-grating alignment system that was process-insensitive. The system requires only two alignment marks for the entire wafer processing sequence. The stepper includes menu-driven software with metrology and test software for maintaining overlay matching between multiple tools.[1]
Where it fits in the process flow
General reference — not yet source-verifiedThe ASML 5500 300 C sits in the lithography segment of the semiconductor fabrication process. One or more coat-develop tracks are typically coupled to the stepper to apply photoresist before exposure and to develop the wafer after exposure. The stepper projects the reticle pattern onto the photoresist-coated wafer. After development, the wafer moves to inspection and then to subsequent etch or deposition steps.
Applications
The ASML 5500 300 C is used for photolithographic exposure in integrated circuit manufacturing. The stepper can handle a variety of substrate materials, including silicon, gallium arsenide, and indium phosphide. The system is suitable for a range of applications from telecommunication components to application-specific integrated circuits.[1]
What do the numbers mean?
Wafer handling8
Optics & imaging8
Control & software5
Configuration & options3
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| PAS 5500/300C | DUV | — | Capable of processing 88 200 mm wafers per hour and incorporates an AERIAL Illuminator. | web.archive.org[1] |
Where are the manuals?
Publicly hosted documents referencing this tool, linked at their original location. Hosted by the linked institutions — availability may change.
- DUV Resist InformationDocumentcornell.edu
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What wafer sizes does the ASML 5500 300 C support?
The ASML 5500 300 C processes 8 inch (200 mm) wafers.[2]
What software release does the 5500 300 C require?
The 5500 300 C supports software release 6.2 and higher, with the actual software release being 6.2.3.[2]
What is the product family of the 5500 300 C?
The 5500 300 C is part of the PAS 5500 product family.[1]
Not publicly documented
The following facts about the 5500 300 C are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 5500 300 C are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the 5500 300 C are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 5500 300 C are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 5500 300 C is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the 5500 300 C are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]web.archive.org — asml.com (Jan 25, 2006)web.archive.org
- [2]Inventory photo
- [3]Equipment Resources | CNF — cnf.cornell.educnf.cornell.edu
Last updated Oct 4, 2026.
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