ASML
300 C
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The ASML 300 C is a model of equipment manufactured by ASML.[1]
What it is
How it works
Where it fits in the process flow
The ASML PAS 5500/300C occupies the lithography segment of semiconductor fabrication, where it performs photolithographic exposure.[3]
One or more coat-develop tracks are typically coupled to the stepper to apply photoresist before exposure and to develop the wafer after exposure.[3]
After development the wafer moves to inspection and then to subsequent etch or deposition steps.[3]
Applications
What do the numbers mean?
No specifications recorded yet
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Where are the manuals?
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Not publicly documented
Field notes
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Frequently asked questions
What wafer sizes does the ASML PAS 5500/300C support?
The ASML PAS 5500/300C processes 8 inch (200 mm) wafers.[3]
What software release does the 5500/300C require?
The 5500/300C supports software release 6.2 and higher, with the actual software release being 6.2.3.[3]
Is the 5500/300C a stepper or a scanner?
The ASML PAS 5500/300C is a stepper.[3]
What is the product family of the 5500/300C?
The ASML PAS 5500/300C is part of the PAS 5500 product family.[3]
What type of illuminator does the 5500/300C use?
The 5500/300C incorporates an AERIAL Illuminator.[3]
Not publicly documented
The following facts about the 300 C are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No specifications for the 300 C are on record.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 300 C are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 300 C are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 300 C are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 300 C are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
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Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]Equipment inventory listing
- [2]300 C — ASML | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
- [3]5500 300 C — ASML | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
Last updated Oct 11, 2026.