ASM
Siplace CA 4 Wafer
The ASM Siplace CA 4 Wafer is an 8-inch wafer system. The ASM Siplace CA 4 Wafer is a high-volume chip assembly and 4-portal microchip/SMD hybrid assembly system. The ASM Siplace CA 4 Wafer includes 4 Siplace Wafer Systems (SWS) 8" with 8" wafer expansion.[1][2]
Wafer size
8"
Vacuum
Vacuum Tooling Single Transport Chuck[1]
Optics
4 LP-Kamera (TYP34) and bonding Head C+P20[1]
How it works
Where it fits in the process flow
What do the numbers mean?
Vacuum & pumping4
Wafer handling7
- excluding Loader[1]
Optics & imaging1
Configuration & options10
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What wafer size does the ASM Siplace CA 4 Wafer handle?
Not publicly documented
The following facts about the Siplace CA 4 Wafer are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Siplace CA 4 Wafer are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Siplace CA 4 Wafer are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Siplace CA 4 Wafer are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Siplace CA 4 Wafer are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Siplace CA 4 Wafer is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]waferpedia.com — waferpedia.comwaferpedia.com
Last updated Oct 11, 2026.
Compare with similar tools
View all →
The Esec 2100 HS is a die bonder for epoxy die attach applications.
The ASM AD 838 is an 8-inch-wafer die bonder with epoxy dispensing and no stack input, operating on single-phase 220 Vac at 50/60 Hz.
Applied Materials model 0010-47763 is an ASSY ESC Bonded Monopolar Dual Heated unit.
The Applied Materials 0041-26723 is a bonded assembly used in semiconductor packaging and bonding applications.