AS 899

The ASM AS 899 is a die bonder used in semiconductor packaging and bonding.^[3]

The ASM AS 899, as a die bonder, uses a pick-and-place mechanism to retrieve individual die from a wafer or tape and place them onto a substrate. The die is typically picked by a vacuum collet and positioned over the bond site. The bonder then applies the die with controlled force and temperature to form the attachment. Some die bonders dispense a precise volume of epoxy or flux before placement, while others use thermocompression or ultrasonic energy to create a metallic bond.

Alignment of the die to the substrate is achieved through vision systems that recognize fiducials on both the die and the substrate. The machine corrects for rotational and translational offsets to meet placement accuracy requirements. The bond head moves in X, Y, and Z axes, often with theta rotation capability. The substrate is typically transported on a conveyor or indexed stage through the bond station.

Die bonders are positioned in the assembly line after wafer dicing and before wire bonding or encapsulation. The incoming material consists of singulated die on a wafer frame or in a gel pack. The output is a substrate or leadframe with one or more die attached, ready for the next interconnection step. In advanced packaging flows, die bonding may occur multiple times in a single package for multi-chip modules or stacked-die configurations.