Applied Materials
The Applied Materials Centura eMXP+ is an etch tool for 8-inch wafers. The Centura eMXP+ is configured for oxide and a nitride spacer process. The Centura eMXP+ operates on 208 VAC at 50/60 Hz with a full load current of 240 A.[1][2]

An etch tool removes selected material from a wafer by exposing the surface to a controlled plasma or reactive process so patterned areas transfer into the film stack.
An etch system sits after pattern definition steps and before later film removal or device completion steps in a fab flow.
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
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The following facts about the Centura eMXP+ are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Centura eMXP+ are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Centura eMXP+ are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Centura eMXP+ are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Centura eMXP+ are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Centura eMXP+ is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 10, 2026.
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