ADT
8020 Auto Twin Dicing
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The ADT 8020 Auto Twin Dicing is a fully automatic twin dicing system. The ADT 8020 Auto Twin Dicing is specified for 8-inch workpieces. The ADT 8020 Auto Twin Dicing has two facing spindles for simultaneous dicing.[1][2]
What it is
The ADT 8020 is a fully automatic twin dicing system designed for semiconductor wafer singulation. The machine supports workpieces up to 8 inches in diameter and features two facing spindles that enable simultaneous dicing for higher throughput. The ADT 8020 is classified under the dicing and grinding category in semiconductor manufacturing equipment.[1][3][2]
How it works
The ADT 8020 employs two facing spindles that can each carry a dicing blade up to 3 inches in diameter. The spindles operate at a maximum rotational speed of 60,000 rpm and are available in power ratings of 1.8 kW or 2.4 kW. The X-axis uses an air-bearing feed slide capable of moving at up to 600 mm/second, while the Y axes use ball-bearing lead screws with linear encoders that provide a cumulative accuracy of 1.5 micrometers.[2]
The system includes an automatic alignment function, automatic cut verification, automatic kerf inspection, and automatic Y-offset correction. A vision system with a USB3 camera and high-brightness LED illumination (vertical and oblique) assists in positioning and inspection. The user interface consists of two touch screens: a 19-inch main monitor and a 17-inch maintenance screen running a New Graphic User Interface (NUI) on Windows 7. A cleaner station provides full rinse and dry cycles with spinning speeds from 100 to 2,000 rpm and atomized cleaning capabilities.[2]
Applications
The ADT 8020 is applied to dicing of silicon wafers for discrete devices, silicon carbide (SiC) substrates, MEMS devices, SAW filters, glass wafers, and packaged devices such as QFN and LED packages. The machine supports hub and hubless blades, and its dual-spindle configuration provides flexibility for a range of workpiece materials and thicknesses.[2]
What do the numbers mean?
Power & electrical3
Wafer handling3
- Options
- BBD (Broken Blade Detector), barcode reader, UV station, USB3 camera with continuous digital magnification from x70 to x290, dress station, dress cassette, ESD kit, high definition optics, Geometric Model Finder (GMF), Dicing Floor Management (SECS/GEM), customization utilities[2]
- Applications
- Silicon wafers, discrete devices, silicon carbide (SiC), MEMS, SAW devices, glass wafer, packaging (QFN, LED…)[2]
Optics & imaging2
Performance3
Control & software2
- User Interface
- Two touch screens: 19-inch main, 17-inch maintenance; NUI, multilanguage, Win7 OS[2]
Dimensions & facilities2
Configuration & options20
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- Disco DAD 3350 Automatic Dicing— Same function class: Dicing & Grinding, nullCompare in depthsource[4]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
How many spindles does the ADT 8020 use?
The ADT 8020 uses two facing spindles.[2]
What blade sizes does the ADT 8020 support?
The ADT 8020 supports hub and hubless blades up to 3 inch outside diameter, and the blade size range is 2 inch to 3 inch.[2]
What automation features are included on the ADT 8020?
The ADT 8020 includes automatic alignment, automatic cut verify, automatic kerf inspection, and automatic Y offset correction.[2]
Not publicly documented
The following facts about the 8020 Auto Twin Dicing are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 8020 Auto Twin Dicing are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 8020 Auto Twin Dicing are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 8020 Auto Twin Dicing are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 8020 Auto Twin Dicing are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 8020 Auto Twin Dicing is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (4)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]gltechadt.com — gltechadt.comgltechadt.com
- [3]manualslib.com — manualslib.commanualslib.com
- [4]web.archive.orgweb.archive.org
Last updated Oct 8, 2026.
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