Accretech
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The Accretech UF 300 A is an automatic wafer prober for 8-inch wafers. The Accretech UF 300 A is configured as a fully automatic system. The Accretech UF 300 A supports multi-die probing up to 256 DUTs.[1]
The UF 300 A performs automatic probe-to-pad alignment, automatic needle height alignment, and probe mark inspection. The system supports simultaneous probing of up to 256 devices under test (DUTs) using multi-die probing. A Cognex 8200 board is employed for vision-based alignment and inspection tasks. The system includes a multi-function cleaning pad, a soak time option, and interfaces for GPIB, RS232, and Ethernet.[1]
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The UF 300 A supports 8-inch wafers.[1]
The UF 300 A is offered with a nickel chuck or a gold plated chuck.[1]
The system supports multi-die probing up to 256 DUTs.[1]
A Cognex board type 8200 is used for vision-based alignment and inspection tasks.[1]
The system provides GPIB, RS232, and Ethernet interfaces.[1]
The following facts about the UF 300 A are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the UF 300 A are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the UF 300 A are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the UF 300 A are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the UF 300 A are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the UF 300 A is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 4, 2026.