Accretech
The Accretech / TSK APM 90 Prober is a wafer prober for 6 and 8 inch wafers. The APM 90 uses a nickel chuck and has a temperature range of 25 to 150 degrees Celsius.[1][2][3][4]

A wafer prober positions a probe assembly onto a wafer so electrical test contact can be made at selected sites on the wafer surface.
A wafer prober sits in electrical wafer test and characterization flow before full device packaging.
A wafer prober is used after wafer fabrication steps that create devices on the wafer and before downstream assembly or final package test.
A wafer prober is used for semiconductor wafer-level testing, parameter measurement, and device evaluation.
Documented failure modes, common issues, and field considerations.
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
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The following facts about the APM 90 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the APM 90 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the APM 90 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the APM 90 are not on record.
Answerable by: an engineer who operated it or OEM installation records
The process node or technology generation of the APM 90 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the APM 90 are on record.
Answerable by: an OEM parts catalog or a service engineer
Last updated Oct 5, 2026.