MRSI

MRSI-HVM1 is a high-volume manufacturing flip-chip die bonder with 1 micron accuracy.

The MRSI-175Ag is a servo-controlled conductive epoxy dispenser with two configurable heads and Windows Workcell software.

The MRSI-M5 is an assembly work cell for precision automation and advanced assembly tasks including epoxy die attach, eutectic bonding, and flip chip bonding.

The MRSI 505 is an ultra-precision, vision-guided, fully automatic, high-speed robotic assembly work cell used for semiconductor pick-and-place and bonding applications.

The MRSI 505 Die Attach is a packaging and bonding tool from MRSI.

MRSI-HVM3 is a high-precision die bonding platform for high-volume production, described by MRSI as a 3-micron class system.

The MRSI 605 is a die bonder and high-precision pick-and-place / soldering machine.

The MRSI 505 Die Attach is a packaging and bonding machine for semiconductor assembly, used for die attach and multichip module work.

The MRSI 705 is a die bonder described as magazine-to-magazine, single-head, gripper-type, manual-loading equipment with 4-stage ramp-up heating and high bondforce capability.

The MRSI-M3 is a 3 micron flip-chip die bonder for research and development prototyping to low/medium volume production.

The MRSI-H3TO is an MRSI-H family die bonder for handling multi-dies and multi-processes for complex TO products without tool changeover.

The MRSI H1/HVM1 are 1-micron die bonders referenced by MRSI Mycronic for high-volume photonics manufacturing.

The MRSI-705HF is a 5-micron high force die bonder with a heated bond head that can apply up to 500N of force and top-side heating up to 400°C.

MRSI-H3 is an earlier name for the MRSI-H series die bonder, which was renamed to MRSI-H in shipments starting October 1, 2019.