The SUSS XBC300 Gen2 D2W is a permanent bonding system offered by SUSS MicroTec.
Cited variants
| Designation | Generation | Vintage | Changes | Source |
|---|
| XBC300 Gen2 D2W/W2W | Gen2 | — | SUSS lists this variant as a separate permanent bonding system, indicating support for both die-to-wafer and wafer-to-wafer bonding. | suss.com[1] |
| XBC300 Gen2 SP | Gen2 | — | SUSS lists this as a distinct permanent bonding system. | suss.com[1] |